LED Wiring via Substrate Through-Holes for Compact Connectivity
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Solution Overview
Problem
Conventional LED lighting apparatuses face challenges in reducing size due to limitations in wiring patterns and increased manufacturing costs, particularly in achieving compact designs while maintaining efficient heat dissipation and uniform brightness.
Innovation Solution
The proposed LED configuration features a substrate with strategically placed lower and upper electrodes, connecting electrodes, and a connecting wiring pattern that allows for compact arrangement and efficient electrical connectivity, enabling reduced size and simplified manufacturing while maintaining heat dissipation and brightness control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If wiring patterns are provided on both sides of the base to connect multiple LED elements, then electrical connectivity is improved, but the width of the base increases and device size increases
Solution Approach 1:
The patent transitions from planar wiring patterns on both sides of the base to a three-dimensional structure where wiring patterns are formed within through-holes penetrating the base. This vertical arrangement in the thickness direction enables electrical connectivity between multiple LED elements without increasing the base width, effectively resolving the contradiction between connectivity and device size.
2Ease of operation
If multiple wiring patterns are arranged in rows to connect island-like semiconductor stacks, then electrical connectivity is improved, but the width and length of the substrate increase
Solution Approach 1:
The patent reconfigures the wiring architecture from horizontal row arrangements on the substrate surface to vertical wiring patterns formed within through-holes. This dimensional transition allows multiple electrical connections to be stacked in the thickness direction rather than spread out horizontally, significantly reducing the substrate area while maintaining full electrical connectivity among semiconductor stacks.
Solution Approach 2:
The wiring patterns are nested within the through-holes of the substrate, utilizing the internal volume of the substrate structure. This nesting approach allows wiring patterns to be contained within the substrate thickness rather than occupying additional lateral space, achieving compact integration without increasing substrate dimensions.
3Adaptability or versatility
If wiring patterns are routed between semiconductor stacks to enable selective light emission, then functionality is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent divides the substrate into multiple through-holes, each containing independent wiring patterns that can be controlled separately. This segmentation allows selective activation of different semiconductor stacks through independent electrical paths, achieving versatile light emission control while using standardized, cost-effective wiring structures in each through-hole.
Solution Approach 2:
The through-hole wiring structure serves multiple functions simultaneously: it provides electrical connectivity, enables selective activation of semiconductor stacks, and maintains mechanical support. This multi-functional design eliminates the need for separate specialized wiring structures, simplifying manufacturing and reducing costs while achieving selective light emission functionality.
Data Source
AI summary
A light-emitting diode includes a substrate, a light-emitting diode element mounted on an upper surface of the substrate, and a sealing member that covers the light-emitting diode element. At least one pair of lower electrodes electrically connected to the light-emitting diode element and at least one pair of connecting electrodes connected to each other are disposed on the substrate. A connecting wiring pattern for connecting the pair of connecting electrodes is provided between the connecting electrodes.