LED Package Size Reduction via WLCSP Integration
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Solution Overview
Problem
Conventional LED packages are bulky and costly due to the stacking of multiple materials, making it difficult to achieve the requirements of being light, thin, short, and small, while also having a complex package process.
Innovation Solution
A wafer level chip scale package (WLCSP) with a conductive substrate and patterned semiconductor structure, including through-holes and tilted sidewalls, is used to reduce package size and simplify the process, while enhancing light extraction efficiency by isolating conductive lines and using bonding pads for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional LED packages use multiple stacked materials for mounting and electrical connection, then reliable electrical connection and structural support are achieved, but package size increases and manufacturing complexity increases
Solution Approach 1:
The patent merges the substrate, conductive lines, and electrical connection structures into a single integrated conductive substrate. The through-holes are formed directly in the substrate, and conductive lines are deposited within these through-holes, eliminating the need for separate mounting structures and wire bonds. This integration directly reduces package volume while maintaining electrical connectivity functions.
Solution Approach 2:
The patent transitions from planar surface mounting to three-dimensional vertical integration by forming through-holes that extend through the substrate thickness. Electrical connections are established in the vertical dimension through these through-holes, allowing compact routing of conductors without increasing the lateral footprint of the device.
2Weight of moving object
If conventional LED packages use multiple stacked materials, then functional requirements are met, but the package becomes heavier and thicker
Solution Approach 1:
Multiple functional layers (substrate, conductive paths, electrical contacts) are merged into a single conductive substrate structure. This consolidation eliminates the weight contribution from multiple separate material layers and their interfacial bonding materials, directly reducing overall package weight.
Solution Approach 2:
The conductive substrate performs multiple functions simultaneously: it provides mechanical support, establishes electrical connections through integrated conductive lines, and serves as the mounting platform for the semiconductor structure. This multi-functionality eliminates the need for separate components, reducing both weight and manufacturing steps.
3Illumination intensity
If conventional LED packages use traditional mounting structures, then electrical connection is achieved, but light extraction efficiency is reduced due to material stacking
Solution Approach 1:
The patent extracts and removes the intermediate mounting materials and bonding layers that traditionally separate the LED chip from the substrate. By forming direct electrical connections through through-holes in the substrate, unnecessary material layers are eliminated, creating a more transparent optical path that improves light extraction efficiency.
Solution Approach 2:
Instead of mounting the LED chip on top of the substrate with conductors bringing up to the chip, the patent inverts the approach by forming conductive paths through the substrate that directly contact the chip electrodes. This inverted connection method removes intervening materials that would otherwise block or scatter light.
Data Source
AI summary
The present invention is related to a light-emitting device. The present invention illustrates a vertical light-emitting device in one embodiment, comprising the following elements: a conductive substrate includes a through-hole, a patterned semiconductor structure disposed on a first surface of the substrate, a first bonding pad and a second bonding pad disposed on a second surface of the substrate, a conductive line passing through the through-hole connecting electrically the semiconductor structure layer, and an insulation layer on at least one sidewall of the through-hole insulates the conductive line form the substrate. The present invention illustrates a horizontal light-emitting device in another embodiment, comprising the following elements: a substrate includes a first tilted sidewall, a patterned semiconductor structure disposed on a first surface of the substrate, a first conductive line is disposed on at least the first tilted sidewall of the substrate and connecting electrically the patterned semiconductor structure.