LED Package Bead Layer for Zener Light Diffusion
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Solution Overview
Problem
In light-emitting diode (LED) packages, Zener diodes absorb a portion of the light generated by the LED chip, leading to reduced luminous efficiency and uneven light output due to the absorption of light by the Zener diodes.
Innovation Solution
A light-emitting diode package and manufacturing method that incorporates a bead member covering the Zener diode, comprising beads dispersed in a translucent resin, which induces diffuse reflection of light emitted from the LED chip, directing it upward and sideward to minimize absorption and enhance uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a Zener diode is incorporated to protect the LED chip against electrostatic discharge, then reliability is improved, but light emission efficiency deteriorates due to light absorption by the Zener diode
Solution Approach 1:
A bead member is introduced as an intermediary component between the light-emitting diode chip and the Zener diode. This bead member covers the Zener diode and induces diffuse reflection of light that would otherwise be absorbed by the Zener diode, thereby preventing light absorption while maintaining the electrostatic discharge protection function.
2Reliability
If a Zener diode is incorporated to protect the LED chip against electrostatic discharge, then reliability is improved, but light output uniformity deteriorates due to uneven light distribution
Solution Approach 1:
The bead member acts as a mediator that diffuses and redirects light around the Zener diode, ensuring uniform light distribution across the package by preventing the Zener diode from creating dark spots or uneven illumination patterns.
3Loss of energy
If the Zener diode is covered with a bead member to reduce light absorption, then light emission efficiency is improved, but device complexity increases
Solution Approach 1:
The bead member serves multiple functions simultaneously: it provides electrostatic discharge protection by covering the Zener diode, induces diffuse reflection to improve light emission efficiency, and ensures uniform light output distribution. This multi-functionality reduces the need for additional separate components.
Solution Approach 2:
The bead member combines several protective and optical functions into a single integrated component, merging the roles of light diffusion, Zener diode coverage, and uniform light distribution enhancement, thereby minimizing the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves light emission efficiency by reducing light absorption and achieving uniform light output across the package, eliminating uneven light distribution issues.
Implementation Method 1
the bead member includes beads inducing diffuse reflection of light emitted from the light-emitting diode chip and incident on the electrostatic discharge protection member
Data Source
AI summary
Embodiments relate to a light-emitting diode package and a manufacturing method thereof and a light emitting device. The light-emitting diode package includes a lead frame comprising a substrate and leads formed on the substrate, a light-emitting diode chip mounted on the lead frame and electrically connected to the lead frame, an electrostatic discharge protection member mounted on the lead frame and electrically connected to the lead frame, a molding member comprising a wall surrounding components of the light-emitting diode package, the wall attached to the outer periphery of the lead frame, and the wall defining a cavity together with the lead frame, and a bead member covering a surface of the electrostatic discharge protection member, wherein the bead member comprising beads inducing diffuse reflection of light emitted from the light-emitting diode chip and incident on the electrostatic discharge protection member.