LEDCOB Lighting Arrangement Thermal Management
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Solution Overview
Problem
Existing light-emitting devices face challenges in heat dissipation, which can lead to reduced efficiency and lifespan, particularly in LED lamps that lack effective thermal management systems.
Innovation Solution
A lighting arrangement comprising a first and second housing portion with radially directed threads, a driver board enclosed by a heat-shrinkable sleeve, and a light emitting diode with chip on board (LEDCOB) mounted externally, where the housing portions engage to form an enclosed cavity with a wire assembly and ground wire for enhanced thermal management and electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If LED lamps are used to improve energy efficiency, then energy consumption is reduced, but heat dissipation becomes insufficient leading to reduced lifespan
Solution Approach 1:
The lamp base is divided into multiple thermally conductive elements (first thermally conductive element, second thermally conductive element, third thermally conductive element) that create multiple independent thermal channels from the LED filament to the heat dissipation fins, improving heat dissipation efficiency while maintaining energy savings
Solution Approach 2:
The mask is introduced as an intermediary component between the lamp base and the external environment, providing an additional thermal channel through its thermally conductive portion that contacts the LED filament and transfers heat to the surrounding air, thereby enhancing overall heat dissipation capability
2Temperature
If a mask is added to enlarge heat dissipation area, then heat dissipation effect is improved, but device complexity increases
Solution Approach 1:
The mask serves multiple functions simultaneously: it acts as a heat dissipation component through its thermally conductive portion that contacts the LED filament, provides structural support within the lamp base, and creates additional surface area for thermal radiation, thereby improving heat dissipation without proportionally increasing complexity
Solution Approach 2:
The thermally conductive elements are integrated directly into the lamp base structure, merging the heat conduction function with the structural support function, eliminating the need for separate heat sink components and reducing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat dissipation and electrical insulation, improving the efficiency and lifespan of the lighting arrangement by creating a thermally enhanced enclosed cavity with the LEDCOB, allowing for better heat dissipation and reliable operation.
Implementation Method 1
a heat-shrinkable sleeve enclosing the driver board and electrically insulating the driver board within the cavity from at least one of the first housing portion and the second housing portion and from the ground wire
Implementation Method 2
a light emitting diode with chip on board (LEDCOB) mounted on an external surface of one of the first housing portion and the second housing portion
Implementation Method 3
One of the first housing portion and the second housing portion can include radially inwardly-directed threads and the other of the first housing portion and the second housing portion can include radially outwardly-directed threads
Data Source
AI summary
A lighting arrangement can include a first housing portion, a second housing portion, a first wire assembly, a driver board, a heat-shrinkable sleeve, a second negative wire, a second positive wire, and a light emitting diode with chip on board (LEDCOB). The first housing portion can be selectively engageable with one another through inwardly-directed threads and outwardly-directed threads to define an enclosed cavity extending along an axis. The first wire assembly can include a first positive wire, a first negative wire, and a ground wire. The driver board can be electrically coupled to the first positive wire and the first negative wire. The heat-shrinkable sleeve can enclose the driver board. The second positive wire and the second negative wire can be electrically coupled to the driver board and the LEDCOB.