Legged Backlight Substrate Layout for Flat Local Dimming Panels

The patent combines multiple substrates into a single integrated substrate structure where multiple LED arrays are mounted on one substrate. This merging approach maintains the local dimming capability across different regions while eliminating the need for separate substrates and their associated cables, thus reducing electrical installation complexity.

The single substrate is designed to perform multiple functions: it serves as the mounting base for multiple LED arrays, provides electrical connections to all arrays through integrated circuits, and enables local dimming control across different regions. This multi-functionality eliminates the need for separate specialized substrates for each LED array.

The patent applies different structural characteristics to different regions of the substrate. In areas where diodes are mounted for local dimming control, the substrate incorporates recessed regions or support structures that prevent lifting. This localized structural modification maintains substrate flatness in critical areas while preserving local dimming functionality.

The diodes and associated electronic components are nested within recessed areas or integrated into the substrate structure in a way that prevents protrusion. This nesting approach allows the diodes to be functional while maintaining the overall flatness of the substrate surface, preventing image quality degradation.

The patent merges multiple cable connections into a single integrated electrical connection system. The LED driver connects to the single substrate through one set of electrical connections, which then distributes power and control signals to multiple LED arrays on the substrate. This eliminates the need for multiple separate cables and connectors, reducing manufacturing cost and installation complexity.

The single electrical connection system performs multiple functions: it provides power to all LED arrays, transmits control signals for local dimming, and establishes electrical continuity across the entire substrate. This multi-functional connection system replaces what would otherwise require multiple separate cable assemblies.