2D Lens Array Optical Connector for High-Density Interconnects
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Solution Overview
Problem
Current optical interconnect systems face scalability issues and high optical loss, limiting their ability to meet the demands of high-performance computing applications, and existing optical connectors lack the form factor and manufacturability needed for efficient optical termination close to the processor.
Innovation Solution
A two-dimensional array of lenses in an optical connector that redirects light at a right angle in free space, using materials like glass or crystalline inorganics, allowing for a low-profile, high-density connection with minimal optical loss, and enabling the use of both single-mode and multimode fibers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If optical cables are used to transfer optical signaling far from the processor, then optical signal transmission is achieved, but electrical-optical conversion creates a bottleneck and increases device complexity
Solution Approach 1:
The patent extracts the electrical-optical conversion components from the optical cable system and integrates them directly into the processor package. This is achieved by incorporating optical transceivers and coupling mechanisms within the processor housing, allowing optical signals to be generated and transmitted directly from the processor without external conversion devices, thereby reducing overall system complexity while maintaining high transmission speeds
Solution Approach 2:
The patent merges the optical transmission function with the processor package by integrating optical transceivers, coupling lenses, and fiber optic interfaces directly into the processor housing. This consolidation eliminates the need for separate electrical-optical conversion stations and external optical cables, creating a unified system that reduces complexity while preserving optical signal transmission capabilities
2Productivity
If parallel connections are used to the processor for optical signaling, then optical throughput capability is achieved, but significant board real estate and pins are required
Solution Approach 1:
The patent transitions from traditional planar board-level connections to three-dimensional vertical integration within the processor package. By stacking optical transceivers, coupling lenses, and fiber interfaces in vertical layers within the processor housing, the system achieves high optical throughput without requiring extensive horizontal board space, effectively moving the connection architecture from two-dimensional to three-dimensional space
Solution Approach 2:
The patent implements a nested architecture where optical transceivers, coupling mechanisms, and fiber optic interfaces are nested within concentric layers of the processor package. The optical components are positioned in nested arrangements with transceivers embedded in substrate layers, coupling lenses positioned in intermediate layers, and fiber interfaces nested at the package perimeter, maximizing throughput while minimizing the external footprint on the circuit board
3Reliability
If current optical components are used, then optical signaling is achieved, but scalability to high-volume manufacturing is limited
Solution Approach 1:
The patent segments the optical system into standardized, modular components that can be independently manufactured and assembled. The optical transceivers, coupling lenses, and fiber interfaces are designed as separate modular units with standardized interfaces, allowing each component to be optimized for high-volume manufacturing using specialized processes while maintaining reliable optical signaling when assembled into the processor package
Solution Approach 2:
The patent optimizes manufacturing parameters by selecting materials and designing component geometries that are compatible with high-volume manufacturing processes. The coupling lenses are designed with standard focal lengths and diameters that can be mass-produced using precision molding, the substrate layers are designed with standard thicknesses compatible with semiconductor fabrication, and the fiber interfaces are positioned at standard pitch intervals that align with automated assembly equipment, thereby enabling scalable production while maintaining optical reliability
4Power
If electrical I/O signaling is used, then current computing performance is achieved, but scaling to higher performance levels is limited by electrical characteristics
Solution Approach 1:
The patent replaces the electrical signaling system with an optical signaling system by substituting electrical conductors and connectors with optical transceivers, coupling lenses, and fiber optic interfaces. This substitution eliminates the fundamental limitations of electrical signaling such as resistive losses, capacitive effects, and signal integrity issues at high frequencies, enabling future performance scaling while maintaining current computing capabilities through the optical transmission medium
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a scalable, low-loss optical connector that can be integrated into processor packages, enhancing optical signal transmission efficiency and supporting high-density, high-performance computing applications.
Implementation Method 1
The lens arrays collimate light directed toward the reflection surface and focus light received from the reflection surface
Implementation Method 2
The lens arrays collimate light directed toward the reflection surface and focus light received from the reflection surface
Implementation Method 3
The reflection surface can be a total internal reflection (TIR) surface or a mirror
Implementation Method 4
The reflection surface can be a total internal reflection (TIR) surface or a mirror
Data Source
AI summary
An optical connector includes a two-dimensional array of lenses to couple optical signals between an optical integrated circuit and an optical fiber. The optical connector has a total-internal-reflection or mirror surface that redirects light between lenses at different surfaces of the optical connector. The lens arrays collimate light directed toward the reflection surface and focuses light received from the reflection surface. The two-dimensional array and prism allows for a low-profile, high-density optical connector based on free space optical light propagation.