Lens Array Substrate Stress Reduction via Recessed Layer Extraction

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Solution Overview

Problem

Existing lens array substrate technologies face issues with crack generation and lens surface deterioration due to stress concentration from thickness differences in the lens layer, especially when high temperatures are applied, and partial polishing of lens surfaces during manufacturing.

Innovation Solution

A method for manufacturing a lens array substrate involving the formation of recess sections on a substrate, where lens surfaces with concave shapes are created at the bottoms of these recesses, and a lens layer is filled inside, with the lens layer being flattened to remove excess material, ensuring it only remains within the recesses, thus minimizing stress concentration and preventing lens surface polishing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the lens layer is formed to cover the entire substrate surface including outside areas, then the lens layer provides comprehensive coverage, but stress concentrates on specific spots causing cracks during high temperature processing

Engineering Contradiction:
Improvecrack prevention in lens layerVSAvoidstress concentration in lens layer
Core Design Contradiction:
ReliabilityVSStress or pressure

Solution Approach 1:

The patent removes the lens layer from the outside areas (areas outside the recess sections) while maintaining it only within the recess sections. This extraction of unnecessary lens layer material eliminates the source of stress concentration that would otherwise cause cracks during high temperature processing, thereby improving reliability without compromising the functional lens areas.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The lens layer is selectively positioned only within the recess sections rather than uniformly across the entire substrate. This creates local quality differentiation where the lens layer exists only where optically functional, reducing overall stress accumulation while maintaining effective lens coverage in the required areas.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If the lens layer is polished to remove excess material, then the lens layer can be selectively removed from outside areas, but the lens surfaces themselves may be partially polished causing deterioration

Engineering Contradiction:
Improveprecise lens layer positioningVSAvoidlens surface integrity
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The recess sections are formed in advance with precise depth control before the lens layer is deposited. By pre-defining the boundaries and depth of recess sections, the lens layer naturally conforms to these boundaries during deposition, eliminating the need for subsequent polishing that could damage the lens surfaces. The preliminary structuring of recess sections enables precise lens layer positioning without harmful follow-up processing.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS10241239B2Lens array substrate, electro-optical device, electronic apparatus, micro-lens substrate manufacturing method, and electro-optical device manufacturing method
Publication Date: 2019.03.26 SEIKO EPSON CORP
  • US10241239B2 patent drawing
  • US10241239B2 patent drawing
  • US10241239B2 patent drawing

AI summary

An element substrate is formed as a lens array substrate on which a plurality of lenses are formed. In a method of manufacturing the lens array substrate, first recess sections are formed on one surface of the substrate, and then a plurality of lens surfaces, which include concave surfaces, are formed at the bottoms of the first recess sections 195. Subsequently, after a light-transmitting lens layer is formed to fill the inside of the first recess sections, flattening is performed while the lens layer is removed. Here, the surface of the lens layer on a side opposite to the substrate is a planar surface which is contiguous to an outside area that is positioned on the outer side of the first recess sections on the one surface of the substrate.