Lens Array Transfer to MEMS Structures

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Solution Overview

Problem

Current methods for manufacturing microelectronic imaging devices with integrated MEMS structures and lenses are expensive and bulky due to separate processes for creating MEMS and lenses, which are then attached together, necessitating a more efficient and less bulky integration method.

Innovation Solution

A method of forming lenses on a wafer and attaching them in an aligned fashion to a wafer containing MEMS structures, eliminating the need for bulky mechanical packaging, and integrating the combined lenses/MEMS structure with an imager wafer to form an imaging device, using techniques such as surface micromachining and ultra-violet curable polymers for lens replication.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If MEMS structures and lenses are created in separate processes and then attached together, then manufacturing flexibility is maintained, but manufacturing cost increases and device bulkiness increases

Engineering Contradiction:

Improvemanufacturing flexibilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent merges the lens formation process with the MEMS structure fabrication by forming lenses directly on the MEMS wafer using UV curable optical polymer. This integration eliminates separate manufacturing processes and attachment steps, reducing both manufacturing cost and device bulkiness while maintaining manufacturing flexibility through the same wafer-level processing approach

Inventive Principle:

Principle #5Merging (Combining)

2Manufacturing precision

If MEMS structures and lenses are created in separate processes and then attached together, then component quality can be optimized independently, but device bulkiness increases

Engineering Contradiction:

Improvecomponent qualityVSAvoiddevice bulkiness

Core Design Contradiction:

Manufacturing precisionVSVolume of stationary object

Solution Approach 1:

The patent combines lens and MEMS structure fabrication into a single integrated process on the same wafer, eliminating the need for separate component manufacturing and attachment. This integration significantly reduces device bulkiness by removing intermediate layers and attachment structures, while component quality is maintained through precise UV curing and alignment processes

Inventive Principle:

Principle #5Merging (Combining)

3Volume of stationary object

If integration methods are simplified to reduce bulkiness, then device size decreases, but manufacturing precision may be compromised

Engineering Contradiction:

Improvedevice sizeVSAvoidalignment precision

Core Design Contradiction:

Volume of stationary objectVSManufacturing precision

Solution Approach 1:

The patent employs preliminary alignment markings and precision alignment processes before UV curing the lens polymer onto the MEMS structures. This preliminary action ensures accurate alignment is achieved before the bonding process, maintaining manufacturing precision even as device size is reduced through integration

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces mechanical attachment methods with UV optical curing to bond the lens polymer to the MEMS structures. This substitution eliminates the need for mechanical packaging and attachment hardware, reducing device bulkiness while maintaining precise alignment through optical curing processes

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces manufacturing costs and bulkiness by directly integrating lenses with MEMS structures on a single wafer, enabling efficient autofocus and zoom applications while simplifying the manufacturing process.

Implementation Method 1

using techniques such as surface micromachining and ultra-violet curable polymers for lens replication

Methodology Applied

Scientific EffectUltra-violet curable: Photopolymerisation

Data Source

PatentUS7920343B2Method of forming lens arrays and transferring such onto movable-MEMS structures

Publication Date: 2011.04.05 APTINA IMAGING CORP

AI summary

Micro-electrical-mechanical (MEMS) wafers in which a lens is formed on a micro-electrical-mechanical structure. The micro-electrical-mechanical wafers can comprise a substrate, MEMS structures, and a lens array. A method of forming a micro-electrical-mechanical wafer comprises providing a substrate, forming a micro-electrical-mechanical structure on the substrate, forming a carrier, forming a lens array on the carrier, and transferring the lens array from the carrier onto the micro-electrical-mechanical structure. The lens array is placed above the micro-electrical-mechanical structure.