Light Source Module Lens Bonding Step for Adhesive Containment

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Solution Overview

Problem

In light source modules using semiconductor lasers, thermal deformation of adhesives can cause the lens to become decentered, leading to deterioration in beam quality due to adhesive displacement into the through hole or effective aperture during positional adjustment.

Innovation Solution

A light source module design featuring a plate with a through hole and an adjustment surface perpendicular to the optical axis, where the lens is adjusted and fixed with an adhesive, and a recessed stepped portion in the bonding area to prevent adhesive entry into the through hole or effective aperture.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the lens is adjusted and fixed with adhesive on a flat bonding surface, then the lens positioning is simple and efficient, but the adhesive may enter the through hole or effective aperture during adjustment, causing beam quality deterioration

Engineering Contradiction:

Improvelens positioning efficiencyVSAvoidbeam quality

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The bonding surface is segmented into two distinct levels: a first surface for adhesive application and a second surface forming a stepped portion that prevents adhesive from reaching the through hole or effective aperture. This segmentation allows the adhesive to be contained in a specific zone during the curing process, eliminating the risk of adhesive contamination while maintaining efficient lens positioning.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The bonding surface transitions from a two-dimensional flat surface to a three-dimensional stepped structure. The stepped portion creates a vertical dimension that physically blocks the adhesive from migrating into the through hole or effective aperture, thereby protecting beam quality while preserving the simplicity of the positioning process.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Strength

If adhesive is applied generously to ensure strong bonding, then the bonding strength increases, but the adhesive may displace and enter the through hole or effective aperture during lens adjustment

Engineering Contradiction:

Improvebonding strengthVSAvoidoptical axis alignment

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The stepped portion creates a localized adhesive containment zone with specific geometric constraints. The adhesive is applied to the first surface and naturally confined by the stepped structure, ensuring adequate bonding strength within the containment zone while preventing excessive adhesive from reaching the through hole or effective aperture. This local quality control maintains both bonding strength and optical precision.

Inventive Principle:

Principle #3Local quality

3Ease of manufacture

If the lens holder is fixed to the housing with adhesive in a state where thermal deformation occurs, then the assembly is simple, but the lens holder displaces vertically or transversely, causing optical axis misalignment

Engineering Contradiction:

Improveassembly simplicityVSAvoidoptical axis accuracy

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The stepped portion is pre-formed on the lens holder before the adhesive bonding process. This preliminary structural feature ensures that when adhesive is applied and cured, any thermal deformation or displacement is constrained by the stepped geometry, preventing the lens holder from shifting vertically or transversely and maintaining optical axis accuracy throughout the bonding process.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design ensures accurate alignment of the lens with the semiconductor laser's optical axis, preventing adhesive-induced distortion and maintaining high beam quality by containing the adhesive within the stepped portion.

Implementation Method 1

an end surface of the lens that is opposite to an optical light-emitting surface of the lens is fixed to the adjustment surface of the plate with an adhesive

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

A stepped portion that is recessed in a direction of the optical axis of the semiconductor laser is formed in a bonding portion in which the end surface of the lens and the adjustment surface are bonded together

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Data Source

PatentUS11183810B2Light source module and light source device including the same

Publication Date: 2021.11.23 SHARP FUKUYAMA LASER CO LTD

AI summary

In a light source module A, a lens shapes emitted light 1a of a semiconductor laser. A plate on which the lens is disposed has a through hole through which the emitted light of the semiconductor laser passes and an adjustment surface that is used for adjusting the position of the lens with respect to the through hole in a direction perpendicular to the optical axis L of the semiconductor laser. An end surface 5b of the lens that is opposite to an optical light-emitting surface of the lens is fixed to the adjustment surface with an adhesive AD. A stepped portion that is recessed in the direction of the optical axis L is formed in a bonding portion in which the end surface of the lens and the adjustment surface are bonded together.