Lens Module Buffering Pad for Drop and Vibration Stability
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Solution Overview
Problem
Camera modules with thermosetting adhesives face detachment issues under stress from drops or vibrations, leading to instability and potential damage to circuit boards.
Innovation Solution
A lens module design incorporating a buffering pad positioned between the circuit board and the fixing assembly, which disperses and absorbs stress, preventing detachment and enhancing stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If thermosetting adhesive is used to mount lens holder and circuit board, then initial bonding strength is achieved, but detachment occurs under stress from drops or vibrations
Solution Approach 1:
A buffering pad is pre-installed between the circuit board and the fixing assembly to provide cushioning before stress occurs. This pad absorbs and disperses stress from drops or vibrations, preventing the thermosetting adhesive from detaching under impact forces.
Solution Approach 2:
The buffering pad serves as an intermediary element between the circuit board and the fixing assembly. It mediates the transmission of stress, reducing the direct force on the adhesive bond while maintaining structural connection.
2Reliability
If buffering pad is added between circuit board and fixing assembly, then stress absorption and stability are improved, but device complexity increases
Solution Approach 1:
The buffering pad performs multiple functions simultaneously: it absorbs stress, provides cushioning against impacts, and maintains the structural connection between components. This multi-functionality justifies the addition of the component by delivering multiple benefits from a single element.
Solution Approach 2:
The buffering pad is implemented as a thin, flexible component that can be easily integrated into the existing structure. Its flexible nature allows it to deform under stress and return to shape, providing protection without adding significant bulk or complexity to the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The buffering pad effectively absorbs and disperses stress, preventing damage to the circuit board and improving the stability and durability of the lens module, while maintaining imaging quality.
Implementation Method 1
the buffering pad 40 disperses and absorbs stress suffered by the fixing assembly 30
Data Source
AI summary
An impact- and vibration-proof lens module includes a fixing assembly, a circuit board, a lens assembly, and a buffering pad. The fixing assembly defines a chamber, and the circuit board is partially disposed in the chamber. The lens assembly is disposed on the circuit board, and the lens assembly is also partially disposed in the chamber. The buffering pad made of thermally conductive silicon is disposed in the chamber and is disposed between the circuit board and the fixing assembly. In the event of being dropped or suffering vibration, the buffering pad disperses and absorbs stress on the fixing assembly to prevent breakage.