Lens Capping Layer Trench Filling for Image Sensor Stability
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Solution Overview
Problem
Image sensing devices face structural failures and flare phenomena in lens capping layers during manufacturing processes like wafer back-grinding and sawing, leading to disengagement from the substrate and other structures.
Innovation Solution
The implementation of a lens capping layer with a specific edge region formed to fill trenches in the pixel-array peripheral region, increasing contact area and minimizing structural damages by extending vertically into the semiconductor substrate, and alternative shapes such as serrated edges to enhance stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the lens capping layer is formed with a conventional flat edge structure, then the manufacturing process is simple, but the lens capping layer experiences structural failure and disengagement during wafer back-grinding and sawing processes
Solution Approach 1:
The lens capping layer is extended vertically into the pixel-array peripheral region by filling trenches, transforming from a conventional flat two-dimensional structure to a three-dimensional structure with increased vertical dimension. This dimensional change provides additional contact area with the substrate and over-coating layer, preventing disengagement during manufacturing processes like wafer back-grinding and sawing.
Solution Approach 2:
The lens capping layer is divided into distinct functional regions: a pixel region portion covering the pixel array and a pixel-array peripheral region portion extending into trenches. This segmentation allows each region to serve its specific function - the pixel region portion provides optical coverage while the peripheral region portion provides mechanical anchoring and structural stability during manufacturing.
2Reliability
If the lens capping layer contact area with over-coating layer is increased by extending vertically, then structural stability is improved, but manufacturing complexity increases
Solution Approach 1:
Trenches are formed in the pixel-array peripheral region before depositing the lens capping layer material. This preliminary action creates pre-defined regions where the lens capping layer will extend vertically, ensuring proper structural formation and maximizing contact area with the over-coating layer while maintaining control over the manufacturing process.
3Reliability
If the lens capping layer is made to extend deeply into trenches, then structural stability during manufacturing is improved, but the likelihood of flare phenomenon increases
Solution Approach 1:
The lens capping layer is designed with different properties in different regions: in the pixel region it provides optical coverage with appropriate thickness, while in the pixel-array peripheral region it extends vertically into trenches to provide mechanical stability. This local differentiation allows the structure to achieve both optical performance and manufacturing stability without causing flare phenomena in the optical region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the likelihood of structural failures and flare phenomena by increasing the contact area between the lens capping layer and the over-coating layer, thereby enhancing the stability and preventing disengagement during manufacturing processes.
Implementation Method 1
a lens layer disposed over the material layer in the pixel region and structured as a lens for collecting incident light into a unit pixel in the pixel region
Data Source
AI summary
An image sensing device includes a semiconductor substrate, a material layer, a lens layer, and a lens capping layer. The semiconductor substrate includes a pixel region, which include a plurality of unit pixels, and a pixel-array peripheral region located outside of and peripheral to the pixel region. The material layer is disposed over the semiconductor substrate in the pixel region and the pixel-array peripheral region, and includes a first trench extending to a predetermined depth in the pixel-array peripheral region. The lens layer is disposed over the material layer in the pixel region and collects incident light into a unit pixel in the pixel region. The lens capping layer is disposed over the lens layer and the material layer and includes an edge region formed to fill the first trench.


