Lens Holder Alignment Features for Image Sensor Precision
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Solution Overview
Problem
The alignment of optical elements on printed circuit boards is challenging due to loose manufacturing tolerances, leading to complex and costly active alignment processes that can also deform the circuit board and affect electronics quality.
Innovation Solution
The use of a lens holder with alignment features that directly contact precise geometric features of the image sensor package to achieve mechanical alignment, bypassing the need for active alignment and intervening structures with looser tolerances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If active alignment process is used to ensure proper alignment of optical elements, then alignment precision is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent applies preliminary action by pre-aligning the lens holder to the image sensor package using alignment features (protrusions and recesses) before mounting to the printed circuit board. This pre-alignment ensures proper optical alignment without requiring complex active alignment processes during manufacturing, thereby reducing device complexity while maintaining alignment precision.
2Manufacturing precision
If active alignment process is used to ensure proper alignment of optical elements, then alignment precision is improved, but manufacturing cost increases
Solution Approach 1:
The alignment features (protrusions on lens holder contacting recesses on image sensor package) perform the alignment function during assembly, eliminating the need for expensive active alignment processes. This preliminary mechanical alignment reduces manufacturing costs while maintaining precision.
3Manufacturing precision
If active alignment process is used to ensure proper alignment of optical elements, then alignment precision is improved, but circuit board deformation occurs
Solution Approach 1:
The lens holder is pre-aligned to the image sensor package using alignment features before both are mounted to the printed circuit board. This preliminary alignment eliminates the need for post-mounting active alignment that would require mechanical adjustments and potentially deform the circuit board, thereby preventing circuit board deformation while maintaining alignment precision.
4Device complexity
If mounting holes in printed circuit board are used for alignment, then device complexity is reduced, but alignment precision deteriorates
Solution Approach 1:
The patent introduces an intermediary alignment mechanism: alignment features (protrusions and recesses) that mediate between the lens holder and image sensor package. This intermediary system provides precise alignment without relying on the loose-tolerance mounting holes in the printed circuit board, thereby maintaining alignment precision while keeping the overall device relatively simple.
Data Source
AI summary
Embodiments related to the alignment of a lens with an image sensor in an optical device are disclosed. For example, one disclosed embodiment comprises an optical device including a printed circuit board, and an image sensor package mounted on the printed circuit board, wherein the image sensor package includes an image sensor. The optical system further comprises a lens holder including a lens, and one or more alignment features arranged on the lens holder. The one or more alignment features are configured to contact the image sensor package to mechanically align the lens holder with the image sensor package.