Lens-Mirror Optical Coupling for Compact Photonic Engine Packaging
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Solution Overview
Problem
Existing technologies face challenges in efficiently integrating optical and electrical components for signal transmission and processing, particularly in forming compact devices that can convert between optical and electrical signals while maintaining high bandwidth and functionality.
Innovation Solution
A compact universal photonic engine (COUPE) package is developed, incorporating an optical interposer with integrated optical ports and lens/reflector modules, utilizing a silicon-on-insulator substrate and advanced manufacturing processes to create optical components like waveguides, couplers, and modulators, and integrating these with electronic circuits through dielectric-to-dielectric and metal-to-metal bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If optical and electrical components are integrated in separate packages, then each component can be optimized independently, but the overall device size increases and signal conversion efficiency decreases
Solution Approach 1:
The patent merges optical components (optical die with waveguides and couplers) and electrical components (electronic die with transistors and interconnects) into a single integrated package. The optical die and electronic die are bonded together through matching bonding interfaces, enabling compact co-location of both component types while maintaining their respective optimizations. This resolving the contradiction by achieving both reduced device size and preserved component optimization through sophisticated packaging integration.
Solution Approach 2:
The patent utilizes three-dimensional stacking and vertical integration to accommodate both optical and electrical components in a compact volume. Multiple dies are bonded in vertical layers with interconnect structures extending through the stack, transforming the traditional planar layout into a multi-layer three-dimensional architecture. This dimensional transition enables high-density integration while maintaining independent optimization of optical and electrical pathways.
2Speed
If optical fiber is directly coupled to electrical components, then signal transmission distance increases, but alignment precision requirements become extremely difficult to meet
Solution Approach 1:
The patent introduces an optical coupler as an intermediary component between the optical fiber and the electrical components. The coupler includes lens structures that focus and redirect light from the fiber to the waveguide input, providing alignment tolerance and reducing the precision requirements for direct fiber-to-component coupling. This intermediary element enables long-distance signal transmission while maintaining manufacturable alignment specifications through its optical field manipulation capabilities.
Solution Approach 2:
The patent segments the coupling function into distinct modular components: the optical fiber interface, the coupler with focusing elements, and the waveguide input. This segmentation allows each component to be independently optimized and aligned to its mating interface with relaxed tolerances, rather than requiring perfect alignment across the entire fiber-to-component path. The modular approach divides the alignment challenge into manageable steps that can be accomplished through standard manufacturing processes.
3Adaptability or versatility
If multiple optical and electrical dies are packaged together, then functionality and bandwidth increase, but packaging process complexity increases
Solution Approach 1:
The patent performs preliminary preparation of bonding interfaces on both optical and electronic dies before final assembly. Bond pads, alignment marks, and surface treatments are pre-formed on each die during their respective fabrication processes. This preliminary action enables rapid, high-precision bonding when the dies are brought together, reducing the complexity of the final packaging process while supporting the integration of multiple functional dies with increased bandwidth capabilities.
Solution Approach 2:
The patent employs universal bonding interface designs that can accommodate different die types (optical, electronic, MEMS) with varying pin counts and geometries. Standardized bonding pad layouts and alignment mark configurations allow the same packaging process to integrate multiple functional components. This universal approach increases device functionality through multi-die integration while minimizing packaging process complexity through process reuse and standardization across different die combinations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-bandwidth signal transmission and processing by efficiently routing optical signals between optical fibers and electrical components, facilitating advanced packaging schemes like CoWoS, resulting in improved device performance.
Implementation Method 1
a first lens located within a first space, wherein the first space is located between the first mirror and an edge coupler within the first optical package
Implementation Method 2
a first mirror; and a first lens located within a first space, wherein the first space is located between the first mirror and an edge coupler within the first optical package
Data Source
AI summary
Optical devices and methods of manufacture are presented in which a first connecting structure with a lens is utilized to transmit and receive optical signals to and from an optical device. In embodiments the first connecting structure comprises a first mirror and a lens aligned with the first mirror. The first mirror and the lens redirect optical signals into and out of the optical devices through an edge coupler within the optical device.