Lens Module with Bent Multilayer Circuit for Compact Sensing
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Solution Overview
Problem
Existing lens modules with sensor-shift technology have a large size due to the use of two bent flexible printed circuits (FPCs) connecting the sensor to a printed circuit board, which increases the overall module size and manufacturing complexity.
Innovation Solution
A lens module design featuring a second circuit board with multiple stacked structural layers and a bent configuration that connects the sensor to the first circuit board, reducing the overall size and manufacturing complexity while maintaining electrical connections and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two bent flexible printed circuits (FPCs) are used to connect the sensor to the printed circuit board, then electrical connections are established, but the overall module size increases
Solution Approach 1:
The patent combines two separate FPCs into a single circuit board structure. The second circuit board is bent to form multiple structural layers that perform the functions of both FPCs, eliminating the need for separate connections and reducing overall module size while maintaining electrical connectivity.
Solution Approach 2:
The patent transitions from a planar two-FPC arrangement to a three-dimensional bent circuit board structure. By bending the second circuit board to form stacked structural layers, the design utilizes vertical space more efficiently, reducing the horizontal footprint and overall module dimensions.
2Reliability
If two bent flexible printed circuits (FPCs) are used to connect the sensor to the printed circuit board, then electrical connections are established, but manufacturing complexity increases
Solution Approach 1:
The patent merges two separate FPC manufacturing processes into a single circuit board fabrication process. The bent second circuit board with multiple structural layers is manufactured as one integrated component, reducing the number of assembly steps and manufacturing complexity while ensuring reliable electrical connections.
Solution Approach 2:
The second circuit board serves multiple functions simultaneously: it provides structural support, establishes electrical connections, and enables the bent configuration for compact integration. This multi-functionality reduces the need for separate components and simplifies manufacturing.
3Ease of manufacture
If a bent circuit board with multiple stacked structural layers is used, then manufacturing complexity is reduced, but structural strength may be compromised
Solution Approach 1:
The patent employs a composite structure with multiple structural layers in the bent circuit board. These layers are stacked and interconnected to provide both the bent configuration for compactness and sufficient structural strength to support the sensor and maintain electrical connections under operational conditions.
Solution Approach 2:
By transitioning to a three-dimensional bent structure with stacked layers, the patent distributes mechanical stresses across multiple planes and layers. This dimensional transformation enhances structural integrity while maintaining the compact form factor and simplifying manufacturing compared to traditional two-FPC designs.
Data Source
AI summary
A lens module includes a lens assembly, a sensing assembly with a supporting member and a sensor, a first circuit board, and a second circuit board. The supporting member is on one side of the lens assembly. The sensor is between them. The first circuit board is adjacent in another direction. The second circuit board connects the sensor and the first circuit board.