Electronic Package Lens Module Layout Without Fiber Support Shelf
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Solution Overview
Problem
Conventional semiconductor packages using silicon photonics technology require complex manufacturing processes and high structural strength, leading to slow production speeds, low yield, and high costs due to the need for a shelf to fix optical fibers.
Innovation Solution
An electronic package design that includes an optoelectronic component with a recess for a lens module, allowing optical signal reception without a separate shelf for optical fibers, simplifying the structure and manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a shelf is added to carry and fix the optical fiber, then the optical fiber can be properly positioned and connected, but the device complexity and manufacturing process complexity increase significantly
Solution Approach 1:
The patent merges the optical fiber fixing function into the existing PIC component structure by creating a recess directly on the PIC substrate. This eliminates the need for a separate shelf structure, as the PIC component itself now serves both as the photonic circuit carrier and as the optical fiber mounting structure. The recess is formed through standard semiconductor fabrication processes, integrating the fixing function into the base component rather than adding a separate structural element.
2Reliability
If a shelf is added to carry and fix the optical fiber, then the optical fiber can be properly positioned and connected, but the manufacturing process becomes too complicated and productivity decreases
Solution Approach 1:
The patent combines the optical fiber mounting structure with the PIC component manufacturing process. The recess is formed using standard semiconductor fabrication techniques (etching, deposition, or molding) that are already part of the PIC production line. This allows the optical fiber fixing structure to be created in the same manufacturing flow as the photonic circuits, eliminating the need for separate assembly steps and maintaining high production efficiency.
3Reliability
If a shelf is added to carry and fix the optical fiber, then the optical fiber can be properly positioned and connected, but the manufacturing cost increases due to lower yield and slower process speed
Solution Approach 1:
The patent integrates the optical fiber fixing structure into the PIC component fabrication process, allowing both the photonic circuits and the mounting structure to be manufactured simultaneously using existing semiconductor fabrication equipment and processes. This eliminates the need for additional specialized manufacturing steps, maintains high production yield, and avoids increasing unit costs.
Solution Approach 2:
The PIC component is designed to serve multiple functions: it acts as both the photonic integrated circuit substrate and the optical fiber mounting structure. The recess in the PIC component provides mechanical support and positioning for the optical fiber while maintaining the electrical and optical functionality of the photonic circuits. This multi-functionality reduces the total component count and simplifies the overall package structure.
Data Source
AI summary
The present disclosure provides an electronic package having an electronic module, an optoelectronic component disposed on and electrically connected to the electronic module, and a lens module disposed on a side of the optoelectronic component. By the implementation of the present disclosure, the electronic package can be used with a laser without the need to provide a shelf for supporting and fixing an optical fiber. Therefore, the structure and manufacturing process of the electronic package can be effectively simplified, thereby improving the yield and the speed of manufacturing and reducing the manufacturing costs.