Lens Module Reinforcing Plate to Reduce Gold Wire Length
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Solution Overview
Problem
The length of gold wires in lens modules affects manufacturing costs, necessitating a more efficient structural design to reduce material costs.
Innovation Solution
Incorporating a reinforcing plate formed by a stamping process with a small R-angle connection between the protruding portion and reinforcing portion, reducing the distance between the circuit board and the photosensitive chip, and integrating a heat sink in a groove formed simultaneously, thereby minimizing gold wire length and production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional structural design is used in the lens module, then the manufacturing process is simpler, but the gold wire length is longer and manufacturing cost is higher
Solution Approach 1:
The patent introduces a Z-directional protruding portion on the circuit board that extends toward the photosensitive chip, creating a three-dimensional structural arrangement. This dimensional change reduces the horizontal distance for gold wire routing while maintaining manufacturing feasibility through stamping processes.
Solution Approach 2:
The circuit board is segmented into a flat portion and a protruding portion with distinct functions. The protruding portion specifically serves to reduce gold wire length, while the flat portion maintains overall structural support, allowing optimized electrical connection paths.
2Quantity of substance
If the distance between circuit board and photosensitive chip is reduced, then gold wire length decreases and cost reduces, but heat dissipation becomes more challenging
Solution Approach 1:
The circuit board is divided into functional zones: the protruding portion optimizes electrical connection by reducing gold wire length, while the groove portion provides dedicated thermal management space for heat sink placement, separating electrical and thermal functions spatially.
Solution Approach 2:
A heat sink is introduced as an intermediary thermal management component, positioned in the groove between the photosensitive chip and the circuit board's flat portion, facilitating heat dissipation without interfering with the optimized electrical connection path.
3Temperature
If additional components like heat sink are integrated, then heat dissipation improves, but device complexity increases
Solution Approach 1:
The circuit board integrates multiple functions into unified structures: the protruding portion combines mechanical support with electrical connection optimization, while the groove combines structural formation with thermal management functionality, reducing the need for separate components.
Solution Approach 2:
The circuit board is designed as a multi-functional component that simultaneously provides mechanical support, optimized electrical connections through its protruding portion, and thermal management integration via its groove, eliminating the need for separate dedicated components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces gold wire length, lowers manufacturing costs, and enhances heat dissipation, maintaining temperature stability while preserving the module's compact size and functionality.
Implementation Method 1
integrating a heat sink in a groove formed simultaneously, thereby minimizing gold wire length and production costs
Data Source
AI summary
A lens module includes a circuit board, a reinforcing plate, a photosensitive chip, and a wire. The circuit board is defined a through hole. The reinforcing plate includes a reinforcing portion and a protruding portion. The protruding portion is disposed on a side of the circuit board. The protruding portion is accommodated in the through hole. The photosensitive chip is accommodated in the through hole. The reinforcing plate, the circuit board, and the photosensitive chip are stacked along a direction. The wire is electrically connecting the photosensitive chip to the circuit board. On a side of the reinforcing plate away from the circuit board, the protruding portion is connected to the reinforcing portion through a curved surface, and a projection width of the curved surface along the direction is less than or equal to 0.03 mm. The present disclosure further provides a terminal device.