Lens Module With Silicon Photonics for Long-Distance Signal Integrity
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Solution Overview
Problem
Existing terminal devices face signal attenuation and electromagnetic interference issues with increasing transmission distances, degrading the quality of electrical signal transmission.
Innovation Solution
Implementing a lens module with a first silicon photonics chip that converts electrical signals to optical signals, which are then transmitted through an optical fiber to a second silicon photonics chip for conversion back to electrical signals, reducing signal attenuation and immunity to electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If electrical signals are transmitted through conventional conductors over long distances, then the transmission distance increases, but signal attenuation increases and electromagnetic interference degrades signal quality
Solution Approach 1:
The patent replaces the electrical signal transmission system with an optical communication system. Electrical signals are converted to optical signals using a light source (LED or laser diode), transmitted through optical fibers, and converted back to electrical signals at the destination. This substitution of electrical transmission with optical transmission eliminates electromagnetic interference and reduces signal attenuation over long distances, directly resolving the technical contradiction between transmission distance and signal quality.
Solution Approach 2:
The patent introduces optical fibers as an intermediary medium to transmit signals. Instead of direct electrical conduction, electrical signals are converted to optical signals that travel through optical fibers. The optical fiber serves as an intermediary that isolates the transmission path from electromagnetic interference, enabling long-distance transmission while maintaining signal integrity. This intermediary approach resolves the contradiction by providing a transmission medium that does not suffer from electromagnetic interference.
2Reliability
If optical communication is implemented to reduce attenuation and electromagnetic interference, then signal stability improves, but device complexity increases
Solution Approach 1:
The patent integrates the optical communication components (light source, optical fiber, photodetector) and signal processing circuits into a single compact module that can be directly mounted on the lens assembly. By merging these components into one integrated unit, the system achieves optical communication capabilities without proportionally increasing overall device complexity. The modular design allows the optical communication function to be added as a single unit rather than requiring separate complex subsystems.
3Object-affected harmful factors
If optical fibers are used for signal transmission, then electromagnetic interference is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent performs preliminary alignment and fixation of the optical fiber to the lens assembly during the manufacturing process. Precise positioning structures and fixation mechanisms are pre-designed and implemented to ensure proper alignment before the product is delivered to the customer. This preliminary action during manufacturing ensures that the optical fiber maintains correct alignment throughout the product's operational life, reducing the need for complex adjustment mechanisms while maintaining low electromagnetic interference transmission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances signal stability and capacity for high-frequency data transmission with reduced attenuation and electromagnetic interference, supporting high-resolution and high-frame rate image data over long distances while minimizing device volume and power consumption.
Implementation Method 1
a first silicon photonics chip to convert the electrical signals to optical signals
Implementation Method 2
transmitted through an optical fiber to a second silicon photonics chip
Implementation Method 3
which are then transmitted through an optical fiber to a second silicon photonics chip for conversion back to electrical signals
Data Source
AI summary
A lens module includes a light source, a first silicon photonics chip, an image sensor, and an optical fiber. The image sensor is electrically connected to the first silicon photonics chip. The optical fiber is coupled to the first silicon photonics chip. The first silicon photonics chip can receive light emitted by the light source and form first optical signals, the image sensor can convert an optical image into electrical signals and transmit the electrical signals to the first silicon photonics chip, the first silicon photonics chip can modulate the first optical signals with the electrical signals to form second optical signals, and the optical fiber can transmit the second optical signal. The present disclosure further provides a terminal device.