Lens Mount Grounding Contact for EMC-Safe Imaging Alignment
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Solution Overview
Problem
Existing imaging systems face issues with electromagnetic compatibility (EMC) and electrostatic discharge (ESD) due to the lack of electrical connection between the lens and the lens holder, which are exacerbated by increasing signal frequency demands and camera size reduction requirements, and unibody lens solutions are costly and limited in application.
Innovation Solution
An imaging system with an electrically conducting element providing a resilient grounding connection between the lens and the PCB, using a conducting element with first and second engagement surfaces that engage with corresponding bearing surfaces of the lens and lens holder or PCB, allowing for flexible assembly without affecting optical alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a unibody lens is used to provide electrical grounding, then EMC and ESD issues are addressed, but the cost increases and application versatility is limited
Solution Approach 1:
The grounding solution is segmented into separate components: a lens holder with integrated grounding contact and a lens assembly that interfaces with it. This allows the grounding function to be provided through modular components rather than requiring a unibody structure, enabling versatile application across different lens and camera configurations while maintaining reliable electrical grounding for EMC and ESD protection
Solution Approach 2:
An intermediary grounding contact structure is introduced between the lens and the camera body. This intermediary component provides the electrical grounding path without requiring direct integration of the lens with the camera body, thus avoiding the limitations of unibody designs while ensuring proper EMC and ESD performance
2Reliability
If multiple design iterations are used to improve noise and EMC performance, then grounding effectiveness is enhanced, but the design complexity and time increase
Solution Approach 1:
The grounding contact structure is preliminarily integrated into the lens holder design, with engagement surfaces and electrical contact paths pre-configured. This preliminary integration ensures proper grounding is established from the outset without requiring multiple design iterations or complex adjustments, reducing both design complexity and development time while maintaining effective noise and EMC performance
3Manufacturing precision
If an adhesive layer is used to attach the lens to the lens holder, then optical alignment is maintained, but electrical grounding is prevented
Solution Approach 1:
The lens holder design incorporates local quality differentiation: an adhesive layer is applied in specific regions to maintain optical alignment between the lens and lens holder, while separate grounding contact surfaces are provided in different locations to establish electrical grounding. This spatial separation of functions allows both optical precision and electrical grounding to be achieved simultaneously without interference
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively addresses EMC and ESD issues by ensuring electrical grounding between the lens and PCB, maintaining optical alignment, and enhancing manufacturing flexibility and ease of assembly.
Implementation Method 1
the electrically conducting element is resilient and comprises first and second engagement surfaces biased to engage with corresponding portions of a bearing surface of the lens and a bearing surface of the lens holder or the PCB
Data Source
Figure 1A
Figure 1B
Figure 2A~2B
AI summary
According to the specification there is provided an imaging system (100) comprising: an imaging device (160) mounted on a PCB (180) of the imaging system; a lens (110); and a lens holder (130). The imaging system further comprises: an electrically conducting element (200, 300, 400, 500, 600) configured to provide an electrical grounding connection between the lens and the PCB (180). According to further aspects, arrangements of a conducting element for providing an electrical grounding of lens of an imaging system are provided.