Lens Mount Grounding Arrangement for Camera EMC and ESD

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Solution Overview

Problem

Existing imaging systems face issues with electromagnetic compatibility (EMC) and electrostatic discharge (ESD) due to the lack of electrical connection between the lens and the lens holder, which are exacerbated by growing signal frequency demands and camera size reduction requirements, particularly in camera units with unibody lenses that are expensive and limited in application.

Innovation Solution

An imaging system with an electrically conducting element providing a resilient connection between the lens and the PCB, using various configurations such as conducting elements with engagement surfaces and recesses to ensure electrical grounding without affecting optical alignment, including snap-fitting and adhesive-based solutions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a unibody lens is used to provide electrical connection, then EMC and ESD performance is improved, but manufacturing cost increases and application flexibility is reduced

Engineering Contradiction:

ImproveEMC and ESD performanceVSAvoidmanufacturing cost and application flexibility

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The lens assembly is divided into separate components (lens element, lens holder, conducting element) rather than using a unibody structure. The conducting element is a separate resilient component that can be independently assembled, enabling electrical connection without requiring expensive unibody lens manufacturing processes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A separate conducting element acts as an intermediary component between the lens holder and PCB. This resilient conducting element provides the electrical connection path while allowing the lens and lens holder to remain structurally separate, avoiding the need for expensive unibody construction.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If multiple design iterations are used to improve noise and EMC performance, then EMC performance is improved, but development time and complexity increase

Engineering Contradiction:

Improvenoise and EMC performanceVSAvoiddesign iteration complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The conducting element is pre-configured with resilient engagement surfaces and contact features during manufacturing. This preliminary design ensures that when assembled, the electrical connection is automatically established without requiring multiple design iterations or complex adjustments to achieve acceptable EMC performance.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The conducting element's resilient properties and engagement surface geometry are optimized to provide reliable electrical contact while maintaining optical alignment. By adjusting parameters such as material elasticity, contact pressure, and engagement surface configuration, the design achieves EMC performance without requiring multiple iterative redesigns.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If the conducting element is resilient with engagement surfaces, then electrical connection reliability is improved, but the risk of affecting optical alignment increases

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidoptical alignment precision

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The engagement surfaces for electrical connection are positioned on the conducting element and lens holder away from the optical path and lens mounting interface. This spatial segmentation allows the resilient conducting element to provide reliable electrical contact without interfering with the precise optical alignment between lens and imaging device.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The conducting element is designed with localized resilient engagement surfaces at specific contact points that do not coincide with optical alignment critical areas. The local mechanical properties (resilience) are concentrated where electrical connection is needed, while optical alignment areas maintain rigid, precise positioning.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively addresses EMC and ESD issues by ensuring electrical grounding between the lens and PCB, maintaining optical alignment, and enhancing manufacturing flexibility and ease, while reducing noise interference.

Implementation Method 1

the electrically conducting element is resilient and comprises first and second engagement surfaces biased to engage with corresponding portions of a bearing surface of the lens and a bearing surface of the lens holder or the PCB

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS12593117B2Imaging system lens mounting arrangement

Publication Date: 2026.03.31 APTIV TECHNOLOGIES AG

AI summary

According to the specification there is provided an imaging system that includes: an imaging device mounted on a PCB of the imaging system; a lens; and a lens holder. The imaging system further includes an electrically conducting element configured to provide an electrical grounding connection between the lens and the PCB. According to further aspects, arrangements of a conducting element for providing an electrical grounding of lens of an imaging system are provided.