Lens Set Opaque Conductive Layer EMI Shielding
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Solution Overview
Problem
Electromagnetic interference (EMI) affects the image quality of digital camera modules in portable electronic devices, necessitating a new image sensor device structure to mitigate this issue.
Innovation Solution
An electronic assembly for an image sensing device is designed with an opaque conductive layer on the lens set, electrically connected to a grounding layer, which reduces EMI by covering the top side, sidewalls, and bottom side of the lens set, thereby providing ground shielding to the image sensing element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an opaque conductive layer is added to the lens set to shield EMI, then EMI protection is improved, but device complexity increases
Solution Approach 1:
The patent merges the EMI shielding function with the existing lens set structure by integrating an opaque conductive layer onto the lens set. This layer is electrically connected to a grounding layer, creating a combined optical-shielding component that reduces EMI to the image sensing element without requiring a separate shielding structure.
Solution Approach 2:
The lens set is given multiple functions: it maintains its primary optical function while simultaneously serving as an EMI shield through the integrated opaque conductive layer. This multi-functional design eliminates the need for additional dedicated shielding components, thereby reducing overall device complexity despite adding EMI protection capability.
2Manufacturing precision
If an opaque conductive layer is disposed on the lens set to reduce EMI, then image quality is improved, but manufacturing complexity increases
Solution Approach 1:
The opaque conductive layer is applied to the lens set during the manufacturing process, before final assembly. The layer is electrically connected to the grounding layer through pre-established connection paths, allowing EMI shielding to be integrated into the manufacturing flow rather than added as a post-assembly modification.
Solution Approach 2:
The patent employs composite material structures by combining the optical lens material with an opaque conductive layer. This composite construction allows the lens set to simultaneously provide optical functionality and EMI shielding, with the conductive layer being integrated through established manufacturing techniques for multi-layer structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively eliminates EMI, enhancing image quality and allowing for flexible application across various image sensing device package structures, including chip scale package (CSP), chip on board (COB), and ceramic leaded chip carrier (CLCC) formats.
Implementation Method 1
an opaque conductive layer disposed on at least a portion of a top side, a sidewall and a bottom side of the lens set, wherein the opaque conductive layer is electrically connected to a grounding layer to reduce electromagnetic interference (EMI) to the image sensing element
Data Source
AI summary
An electronic assembly for an image sensing device is disclosed, comprising an image sensing element, a lens set comprising a feet enclosing a cavity to receive the image sensing element and an opaque conductive layer disposed on at least a portion of a top side, a sidewall and a bottom side of the lens set, wherein the opaque conductive layer is electrically connected to a grounding layer to reduce electromagnetic interference (EMI) to the image sensing element.