Lens Driving Unit Spring-Damper Structure for Stable Coil Soldering
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Solution Overview
Problem
Existing camera modules, particularly those in miniature low-power devices like smartphones, face challenges with preventing damage to the second coil due to external impacts and ensuring stable soldering, as well as minimizing vibration and movement of the coil during the soldering process.
Innovation Solution
A lens moving apparatus is designed with a housing, bobbin, first coil, magnet, upper spring, circuit board, and damper, where the second coil is securely positioned and soldered to the upper spring without additional lines, preventing disconnection and vibration, thereby enhancing solderability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the second coil is directly connected to the upper spring without additional lines, then the device complexity is reduced, but the reliability deteriorates due to potential disconnection or damage from external impacts
Solution Approach 1:
The patent applies beforehand cushioning by providing a protective structure (housing with integrated support) that anticipates and prevents damage from external impacts to the second coil. The housing is designed to cushion and protect the coil connections from shock and vibration during soldering and operation, preventing disconnection before it can occur.
2Manufacturing precision
If the second coil is securely fixed to prevent movement and vibration, then the manufacturing precision is improved, but the device complexity increases due to additional fixing structures
Solution Approach 1:
The patent merges the protective housing structure with the coil support function into a single integrated component. The housing serves both as the outer protective enclosure and as the structural element that supports and stabilizes the second coil during soldering and operation, eliminating the need for separate fixing structures.
Solution Approach 2:
The housing is designed with multi-functionality, serving as both the protective enclosure and the support structure for the second coil. This universal structure provides both protection from external impacts and stabilization during soldering without requiring additional dedicated components.
3Reliability
If additional protective structures are added to prevent coil damage, then the reliability is improved, but the device complexity increases
Solution Approach 1:
The protective function is merged with the existing housing structure rather than being added as a separate component. The housing is designed to inherently provide protection to the second coil through its structural design, combining the protective function with the enclosure function in a single element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents damage and disconnection of the second coil from external impacts and ensures stable soldering, improving the reliability and durability of the camera module by reducing movement and vibration of the coil during the soldering process.
Implementation Method 1
a first coil disposed on the bobbin, a magnet disposed on the housing... the first coil and the second coil respectively generate induction voltage by electromagnetic interaction
Implementation Method 2
the first coil and the second coil respectively generate induction voltage by electromagnetic interaction
Implementation Method 3
an upper spring coupled both to an upper portion of the bobbin and to an upper portion of the housing
Implementation Method 4
a damper disposed on the upper spring... preventing movement or vibration of the second coil
Data Source
AI summary
An embodiment includes a housing, a bobbin disposed in the housing, a first coil disposed on the bobbin, a magnet disposed in the housing, an upper spring coupled to an upper part of the bobbin and an upper part of the housing, a circuit substrate disposed under the housing, a support member electrically connecting the upper spring and the circuit substrate, and a damper disposed on the upper spring, wherein the upper spring includes an outer side portion coupled to the housing, a first coupling portion coupled to the support member, and a first connecting portion which connects the outer side portion and the first coupling portion, the first coupling portion further including a first extension extending from the first coupling portion toward the outer side portion, the first extension is spaced apart from the outer side portion, and the damper connects the first extension and the outer side portion.