Lensless Near-Contact Imaging for Wide-Field Micro Assembly
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Solution Overview
Problem
Current machine vision systems face a tradeoff between optical resolution and field of view, limiting their ability to efficiently inspect micro-objects and microscale devices over large areas, which is critical for microassembly processes in displays.
Innovation Solution
A machine vision system utilizing high pixel count large format sensors and lensless near-contact image-capture modules (LNCIM) with grayscale and super-resolution image processing techniques to capture high-resolution images over a large field of view, enabling efficient microassembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional optics with lenses are used to focus micro-objects onto a pixelated sensor, then optical resolution can be achieved, but the field of view is limited due to aberrations and the space-bandwidth product constraint
Solution Approach 1:
The patent removes the lens component from the imaging system entirely, extracting the focusing function and replacing it with computational methods. This eliminates the fundamental optical constraints that limit the field of view while maintaining resolution through the sensor's native pixel array and algorithmic reconstruction techniques.
Solution Approach 2:
The patent replaces the mechanical/optical focusing system (lenses) with a computational system. Instead of using optical physics to focus light, the system uses digital signal processing and algorithms to reconstruct images from raw sensor data, substituting physical optics with computational mathematics.
2Measurement precision
If high-resolution image capture is performed over small increments of a large working area, then optical resolution is maintained, but the overall assembly time significantly increases
Solution Approach 1:
The patent segments the imaging function into multiple independent lensless near-contact image-capture modules, each covering a specific region. These modules can operate simultaneously and independently, capturing images of different regions in parallel, thereby maintaining high resolution while reducing the total time required to cover large working areas.
Solution Approach 2:
The patent enables continuous imaging across large areas by having multiple capture modules operate simultaneously without requiring sequential scanning. The system maintains continuous useful action by capturing images from multiple regions at the same time, eliminating the time loss associated with moving between regions or waiting for sequential capture.
3Quantity of substance
If the microassembler backplane size is increased to accommodate more micro-objects, then the assembly capacity increases, but the requirement for high-resolution imaging over larger areas becomes more stringent
Solution Approach 1:
The patent transitions from a single-dimension approach (one lens-based camera) to a multi-dimensional approach by deploying an array of lensless near-contact image-capture modules across the backplane. This spatial distribution in multiple dimensions allows each module to maintain high resolution over its local area while collectively covering the entire large backplane surface.
Solution Approach 2:
The patent creates a universal imaging system where multiple identical capture modules serve different regions of the backplane. Each module is functionally identical and can be replicated across the entire surface, providing consistent high-resolution imaging capability universally across all areas of the enlarged backplane without requiring different optical systems for different regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves high-resolution imaging over a large area, improving the space-bandwidth product and enabling efficient microassembly of micro-objects and devices like micro-LEDs on planar surfaces.
Implementation Method 1
capture images of diffraction patterns of micro-objects disposed on a planar working surface
Data Source
AI summary
A machine vision system uses lensless near-contact imaging with coherent illumination, or incoherent illumination, and high pixel count large format sensors (e.g., equivalent to at least 20 to 65 mega-pixels) to produce diffraction patterns of the micro-objects or the gray scale images of the micro-objects over a large overall field-of-view of the machine vision system. The machine vision system provides feedback to a microassembler system to position, orient, and assemble microscale devices, such as micro-LEDs, over large working areas. The effective resolution of the machine vision system can be further improved by using grayscale and super-resolution image processing techniques.