Leveling Apparatus for Atomic Force Microscope Arrays
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Solution Overview
Problem
Current methods for leveling arrays of tips or polymer pens with a substrate are time-consuming and prone to damaging the array, as they require multiple repeat tests to achieve accurate leveling, increasing costs and reducing the array's lifespan.
Innovation Solution
A leveling apparatus that uses force sensors to measure force at three or more points and an angle adjusting unit to automatically adjust the angle between the object and the substrate, allowing for rapid and precise leveling by calculating the relative inclination and aligning the object with the substrate's geometric center.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple repeat tests are conducted to achieve accurate leveling by measuring force changes with angle changes, then leveling precision is improved, but time consumption increases and array damage risk increases
Solution Approach 1:
The patent applies preliminary action by pre-calculating the theoretical force distribution pattern that corresponds to the leveled state before actual leveling occurs. The controller compares real-time force sensor data against this pre-established theoretical pattern, enabling rapid determination of leveling status without requiring multiple iterative tests. This reduces leveling time while maintaining precision by providing a reference framework in advance.
Solution Approach 2:
The patent implements feedback by continuously monitoring force values from multiple sensors during the leveling process and comparing them against theoretical force distribution. The controller provides real-time feedback on whether the array is properly leveled based on this comparison, allowing for single-pass or minimal-pass leveling rather than multiple repeat tests. This feedback mechanism enables precise leveling determination without time-consuming iterations.
2Measurement precision
If multiple repeat tests are conducted to achieve accurate leveling, then leveling precision is improved, but array lifespan decreases due to damage
Solution Approach 1:
By pre-calculating the theoretical force distribution pattern for the leveled state, the system establishes a reference before subjecting the array to repeated testing stresses. This allows the array to be leveled with minimal tests by comparing against the pre-established pattern, thereby maintaining precision while reducing mechanical stress and extending array lifespan.
Solution Approach 2:
The real-time feedback mechanism compares actual force sensor readings against the theoretical force distribution during the leveling process. This enables the system to determine leveling accuracy in one or few measurements rather than multiple repeat tests, reducing cumulative mechanical stress on the array and preserving its lifespan while maintaining high precision.
3Device complexity
If force is measured at only one point, then device complexity is reduced, but leveling precision deteriorates
Solution Approach 1:
The patent applies segmentation by dividing the force measurement function across multiple sensors positioned at different locations on the array. Each sensor measures force at its specific position, and the controller integrates these distributed measurements to determine overall leveling status. This segmented approach provides comprehensive coverage of the array's force distribution, enabling precise leveling measurement without requiring overly complex sensor arrangements.
Solution Approach 2:
The patent implements local quality by strategically positioning force sensors at specific locations on the array where they can most effectively detect leveling status. Rather than uniformly distributing sensors or using a single complex sensor, the system places sensors at key positions that provide optimal information about the array's orientation and contact with the substrate, achieving high measurement precision with a relatively simple sensor configuration.
4Speed
If the array is brought into contact with the substrate without proper leveling, then operation speed is improved, but manufacturing precision deteriorates
Solution Approach 1:
The patent implements feedback by continuously monitoring force sensor readings during the contact establishment process and comparing them against the theoretical force distribution for proper leveling. This real-time feedback enables the system to verify correct leveling before lithography begins, ensuring manufacturing precision is maintained while allowing for rapid contact establishment. The feedback mechanism prevents premature lithography on improperly leveled arrays without requiring slow iterative adjustments.
Solution Approach 2:
By pre-calculating the theoretical force distribution pattern for the correctly leveled state, the system establishes a reference before contact with the substrate. This allows for rapid verification of proper leveling immediately upon contact, enabling fast operation speed while ensuring that lithography only proceeds when precision requirements are met. The preliminary theoretical model enables instant assessment of leveling accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the time required for leveling, minimizes damage to the array, and enhances productivity in dip-pen nanolithography and polymer pen lithography by enabling automatic and precise alignment of the array with the substrate.
Implementation Method 1
force sensors disposed to measure force at at least three points on the other side of the object
Data Source
AI summary
The present invention relates to a leveling apparatus that levels an object to be leveled with a surface of a substrate by measuring the force applied to the object, and an atomic force microscope including the leveling apparatus.A leveling apparatus according to the present invention, which levels an object with a substrate such that one side of the object is brought in parallel contact with the surface of the substrate, includes: force sensors disposed to measure force at at least three points on the other side of the object; an angle adjusting unit disposed to adjust the angle between the object and the surface of the substrate; and a controller connecting with the force sensors and the angle adjusting unit to drive the angle adjusting unit on the basis of data from the force sensors. The controller obtains the data on force applied to the force sensors by bringing one side of the object in contact with the surface of the substrate at a predetermined angle, calculates the degree of relative inclination between the object and the surface of the substrate from the data on force, and levels the object with the surface of the substrate by adjusting the angle of the object or the substrate with the angle adjusting unit on the basis of the degree of relative inclination.