Leveling Layer for Conformal Back Grind Tape Attachment
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Solution Overview
Problem
The existing methods for manufacturing electrical packages with uneven surfaces face challenges in moisture and contamination protection due to non-conformal attachment of back grind (BG) tapes, leading to quality degradation.
Innovation Solution
A method involving the formation of a leveling layer on the uneven surface to create a smoother surface, allowing for conformal attachment of tapes or carriers, which enhances protection during subsequent removal operations by reducing voids and gaps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a BG tape is used to protect the carrier from moisture or contamination, then the carrier is protected, but when the carrier has an uneven surface, the BG tape cannot conformally attach, resulting in moisture or contamination entering between the carrier and BG tape
Solution Approach 1:
A leveling layer is formed on the uneven surface of the carrier before the BG tape is applied. This preliminary action creates a flat surface that enables conformal attachment of the BG tape, preventing moisture or contamination ingress while maintaining protection quality
Solution Approach 2:
The leveling layer acts as an intermediary between the uneven carrier surface and the BG tape. It mediates the surface uniformity issue by providing a flat interface, allowing the BG tape to attach conformally without direct contact with the uneven carrier surface
2Strength
If the carrier surface is left uneven to maintain structural integrity, then the carrier strength is preserved, but the BG tape cannot attach conformally, leading to quality degradation
Solution Approach 1:
The solution segments the carrier surface modification into two independent parts: the carrier structure itself (maintaining its strength and original uneven surface) and the leveling layer (providing surface uniformity). This allows the carrier to retain its structural integrity while the leveling layer ensures conformal BG tape attachment for product quality
3Manufacturing precision
If a leveling layer is formed to create a smoother surface, then conformal attachment of tapes is enabled, but the manufacturing process becomes more complex
Solution Approach 1:
The leveling layer modifies the surface parameter (flatness) of the carrier without changing the carrier's fundamental structure or requiring complex equipment. By changing the surface topology through a simple coating process, conformal attachment is enabled while keeping the overall manufacturing process relatively simple
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents moisture and contamination ingress, improving the quality and yield of electrical packages by ensuring tight and conformal attachment of protective tapes or carriers even in pressure-decreasing environments.
Implementation Method 1
forming an adhesive layer on the second surface of the substrate, wherein the adhesive layer comprises a material configured to surround the component or fill into the recesses
Data Source
AI summary
A method for manufacturing an electrical package is provided. The method include: providing a substrate having a first surface and a second surface opposite to the first surface, wherein the second surface has a first level difference; forming an adhesive layer on the second surface of the substrate, wherein the adhesive layer is configured to cover the second surface and provides a third surface spaced apart from the second surface of the substrate, wherein the third surface has a second level difference; disposing a tape on the third surface of the adhesive layer; and performing a removing operation on the first surface of the substrate; wherein the second level difference is smaller than the first level difference.