Levenson Mask Pattern Formation with Sacrificial Support
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Solution Overview
Problem
As semiconductor devices miniaturize, Levenson-type masks face challenges in maintaining dimensional accuracy due to reduced distance between undercut portions, leading to potential stripping of the light-shielding film and difficulties in forming fine patterns with high resolution.
Innovation Solution
A method involving multiple exposures using both Levenson-type and half tone-type masks, where the exposure amount of the second exposure step is adjusted relative to the first exposure step to optimize pattern formation, and the arrangement of same and reverse phase opening portions on the Levenson-type mask is optimized to prevent film stripping and enhance dimensional accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the distance between undercut portions is reduced to enable device miniaturization, then smaller feature sizes are achieved, but the light-shielding film may strip due to insufficient support
Solution Approach 1:
The patent performs preliminary actions by forming mandrel patterns and sacrificial patterns before final pattern formation. The sacrificial patterns are intentionally placed at strategic locations to provide support during etching, preventing film stripping. After serving their support function, the sacrificial patterns are removed, leaving the desired fine patterns intact.
Solution Approach 2:
The patent introduces sacrificial patterns as intermediary elements that temporarily serve as support structures during the etching process. These sacrificial patterns act as mediators between the undercut portions, providing necessary mechanical support to prevent light-shielding film stripping. The intermediaries are removed after fulfilling their support function.
2Manufacturing precision
If multiple exposure steps are used to form fine patterns, then dimensional accuracy is improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the pattern formation process into multiple distinct exposure steps: first exposure to form mandrel patterns, second exposure to form sacrificial patterns, and third exposure to form final patterns. Each exposure step targets specific pattern elements, allowing precise control over the final pattern geometry and dimensional accuracy.
Solution Approach 2:
The patent utilizes parameter changes by adjusting exposure amounts, wavelengths, and focus conditions across different exposure steps. The first exposure uses conditions optimized for mandrel pattern formation, while subsequent exposures use adjusted parameters to form sacrificial and final patterns, enabling precise dimensional control despite increased process steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the formation of fine patterns with improved dimensional accuracy and prevents film stripping, enabling the creation of semiconductor devices with smaller feature sizes while maintaining high manufacturing yields.
Implementation Method 1
a light transmitting portion is formed on one side of opposite sides of a part to allow light to pass through and a light transmitting portion is formed on the other side to cause phase reversal with respect to the phase of light of the light transmitting portion on one side
Implementation Method 2
a light transmitting portion is formed in one of a part or a surrounding part of the part and a light-shielding portion is formed in the other, which allows light to partially pass through it and additionally reverses the phase
Data Source
AI summary
A method of forming a pattern including a first pattern portion having a first minimum dimension and a second pattern portion having a second minimum dimension includes a first exposure step of performing exposure using a Levenson-type mask and a second exposure step of performing exposure using a half tone-type mask. When second minimum dimension is 1.3 time or more than the first minimum dimension, the exposure amount of the second exposure step is set to be equal to or smaller than the exposure amount of the first exposure step.


