Lever-Actuated Cold Plate for Low-Friction Removable Module Cooling
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Solution Overview
Problem
Establishing good thermal contact between a cold plate and a removable electronic module is challenging due to surface imperfections and the removable nature of the module, leading to friction and damage issues with conventional methods like applying high contact pressure or using thermal interface materials.
Innovation Solution
A cooling module with a movable cold plate actuated by a lever, allowing for controlled application of biasing force to establish thermal contact, eliminating the need for thermal interface materials and reducing friction during module insertion/removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cold plate is pressed against a removable electronic module to establish thermal contact, then heat transfer efficiency is improved, but insertion and removal forces increase causing damage risk
Solution Approach 1:
The cold plate is made movable between a first position (disengaged) and a second position (engaged with thermal contact). A biasing member provides dynamic force adjustment, allowing the cold plate to apply sufficient pressure for heat transfer when engaged, while easily retracting during insertion/removal operations to minimize damaging forces.
2Temperature
If thermal interface materials are used to improve thermal contact, then thermal conductivity is improved, but device complexity and material requirements increase
Solution Approach 1:
The patent removes thermal interface materials from the system entirely. Instead of relying on external thermal compounds or pads, the design achieves direct thermal contact between the cold plate and the electronic module through precise mechanical engagement and surface matching, eliminating the need for additional thermal interface materials.
3Ease of operation
If a movable cold plate mechanism is implemented to control thermal contact, then ease of insertion/removal is improved, but device complexity increases
Solution Approach 1:
The movable cold plate mechanism is integrated with the housing structure of the electronic device. The biasing member is incorporated into the housing, and the cold plate serves dual purposes as both a structural component and a thermal management element. This merging approach adds minimal complexity while enabling easy insertion and removal operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy installation/removal of removable electronic modules while maintaining effective thermal contact without damaging thermal interface materials, preventing repetitive force-related damage and ensuring efficient heat removal.
Implementation Method 1
A removable electronic module, such as a power supply unit, a small form-factor removable (SFP) transceiver, a non-volatile memory express (NVMe) storage, or the like may be connected to an electronic device, such as a server whenever required for performing their respective functions. Further, such removable electronic modules may generate heat, while performing their respective functions. If adequate amount of the heat is not removed from the removable electronic module, it may exceed thermal specifications of the removable electronic module
Implementation Method 2
a force application member, such as spring fingers, that applies a biasing force to the cold plate to establish thermal contact with the removable electronic module
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
Cooling module includes a mounting element, a force application member, a lever, and a cold plate movably coupled to the mounting element. The mounting element having engagement members, is coupled to a receptacle of an electronic device that is configured to receive a removable electronic device at the receptacle. The force application member having spring fingers, is disposed between the mounting element and the cold plate, and movable relative to the mounting element. The lever is connected to the mounting element and the force application member and shiftable between actuated and unactuated states. In the actuated state, the lever pushes the force application member along a first direction causing the engagement members to move the force application member along a second direction perpendicular to the first direction and urge the cold plate to compress the spring fingers and establish thermal contact between the cold plate and the removable electronic module.