Levitation Carrier Transfer for Accurate Electronic Component Handling
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Solution Overview
Problem
Existing systems for transporting semiconductor components suffer from positional inaccuracy due to oscillations in levitation fields, which prevents successful application in semiconductor assembly.
Innovation Solution
A system utilizing a carrier with tailored properties to stabilize the levitation of electronic components, combined with a transducer system generating a levitation field and a controller for precise movement, along with attaching and detaching agents for fluidic adhesion and alignment, ensures stable positioning and transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If levitation field is used to transport electronic component, then mechanical complexity is reduced and damage risk is lowered, but positional accuracy deteriorates due to oscillations
Solution Approach 1:
A carrier is introduced as an intermediary object between the levitation field and the electronic component. The carrier has tailored properties (shape, weight, density) that are optimized for stable levitation, while the electronic component is attached to the carrier. This mediator absorbs the oscillations of the levitation field, providing a stable platform for transporting the component with positional accuracy.
Solution Approach 2:
The properties of the carrier (shape, weight, density) are specifically tailored to match the characteristics of the levitation field. By adjusting these parameters, the carrier achieves optimal levitation stability with minimal oscillations, thereby maintaining positional accuracy while using the simpler levitation-based transport system.
2Object-affected harmful factors
If electronic component is levitated directly, then mechanical contact is eliminated, but positional stability deteriorates due to oscillations
Solution Approach 1:
The carrier serves as a mediator that is levitated by the acoustic field while the electronic component rests on the carrier. This indirect levitation approach eliminates mechanical contact between the pickup tool and component, yet the carrier provides a stable platform that reduces oscillations and improves positional stability.
Solution Approach 2:
The carrier's physical parameters (mass, shape, surface area) are specifically designed to interact optimally with the acoustic levitation field. This creates a stable levitation state with minimized oscillations, maintaining both contactless transport and positional stability.
3Manufacturing precision
If carrier with tailored properties is used, then positional accuracy is improved, but system complexity increases due to additional carrier management
Solution Approach 1:
The carrier is designed to be self-aligning and self-stabilizing in the levitation field. Its tailored properties cause it to naturally assume the correct orientation and position without requiring complex active control systems. The carrier essentially serves itself by using its own physical properties to achieve stable, accurate transport.
Solution Approach 2:
By carefully selecting the carrier's physical parameters, the system achieves stable levitation and accurate positioning through passive physical principles rather than active control. This reduces the need for complex control algorithms and actuators, balancing positional accuracy with manageable system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves reduced positional oscillations and improved accuracy in transferring semiconductor components, simplifying machine complexity and reducing the risk of damage, enabling efficient assembly processes.
Implementation Method 1
a transducer system comprising a plurality of transducers, wherein the transducer system is configured for generating a levitation field in which the carrier levitates
Implementation Method 2
The first attaching agent is configured to attach the electronic component to the carrier when receiving the electronic component. The first attaching agent may be a liquid, such as water. In this case, the electronic component may be held to the carrier by means of fluidic adhesion.
Data Source
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AI summary
Aspects of the present disclosure relate to a system for transporting an electronic component. Further aspects of the present disclosure relate to a method for transporting an electronic component. According to an aspect of the present disclosure a system for transporting an electronic component is provided that comprises a carrier for carrying the electronic component, and a transducer system comprising a plurality of transducers, the transducer system being configured for generating a levitation field in which the carrier levitates. The system also comprises an input unit for arranging the electronic component onto the carrier, and an output unit for receiving the electronic component from the carrier. A controller is used for controlling the transducer system to change the levitation field for the purpose of moving the carrier from the input unit to the output unit.