Levitation Carrier Transfer for Accurate Electronic Component Placement
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Solution Overview
Problem
Existing systems for transporting electronic components, such as semiconductor dies, face challenges with positional inaccuracy due to oscillations in levitation fields, which prevents successful application in semiconductor assembly.
Innovation Solution
A system comprising a carrier and a transducer system generating a levitation field, where the carrier is designed to minimize positional oscillations by being larger and flatter than the electronic component, and using a first attaching agent like water for secure transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If levitation field is used to transport electronic component, then mechanical contact is reduced and damage risk is lowered, but positional accuracy deteriorates due to oscillations
Solution Approach 1:
A carrier is introduced as an intermediary object between the levitation field and the electronic component. The carrier has higher density than the electronic component, allowing it to be selectively manipulated by the levitation field while the component remains stable on top. This mediator approach enables indirect positioning without directly levitating the fragile component, thus maintaining positional accuracy while preserving the contactless benefits.
Solution Approach 2:
The density parameter is strategically changed by selecting carrier materials with higher density than the electronic component (e.g., tungsten, lead, or depleted uranium). This parameter differentiation allows the levitation field to preferentially affect the carrier rather than the component, stabilizing the component's position during transport and eliminating oscillation-induced positioning errors.
2Stability of the object's composition
If carrier with different density than electronic component is used, then positioning stability is improved, but system complexity increases
Solution Approach 1:
The complex mechanical pickup and placement mechanisms are replaced with a field-based levitation system that manipulates the carrier through acoustic or magnetic fields. By substituting mechanical contact with field interaction, the system achieves precise positioning stability without requiring complex mechanical grippers, clamps, or alignment mechanisms, thereby reducing overall system complexity despite the added carrier component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves stable and accurate positioning of electronic components during transfer, reducing the risk of damage and enhancing assembly efficiency by minimizing mechanical contact and complexity.
Implementation Method 1
a transducer system (130) configured for generating an acoustic levitation field in which the carrier (220) levitates
Implementation Method 2
a first attaching agent (111A) for attaching the electronic component (230) to the carrier (220) when receiving the electronic component
Implementation Method 3
a light source (121) configured for illuminating the first attaching agent (111A) for the purpose of breaking said attachment by the first attaching agent (111A), wherein the first attaching agent (111A) is configured to evaporate because of illuminating the first attaching agent (111A)
Data Source
Figure 1
Figure 2I~2III
Figure 3I~3II
AI summary
Aspects of the present disclosure relate to a system for transferring an electronic component. Further aspects of the present disclosure relate to a method for transferring an electronic component. According to an aspect of the present disclosure, the system comprises a carrier having a first side, a droplet dispensing unit for dispensing a droplet of liquid on the first side of the carrier, and a separating unit for releasing an electronic component from a donor substrate and for allowing the electronic component to be held by the droplet of liquid on the first side of the carrier. The system further comprises an optical source for emitting a pulse of light through the carrier towards an interface between the droplet and the carrier to locally vaporize the droplet thereby causing a jet to be formed from the droplet that on one end holds the electronic component and that subsequently breaks to thereby release the electronic component onto a target substrate.