Levitation Stabilizing Structure for Atmospheric ALD Substrate Control
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Solution Overview
Problem
Existing substrate processing methods using fluidic levitation face challenges in maintaining positional stability and preventing lateral motion of substrates during processing, particularly with reactive chemical fluids, leading to equipment failure and substrate defects due to uncontrollable reactivity and deposition issues.
Innovation Solution
A method employing a levitation stabilizing structure and orthogonal jets to stabilize the substrate during fluidic levitation, using a pressurized-fluid source to impinge on the substrate and restrict lateral motion, while employing coaxial or collinear compound fluid flows to manage chemical reactivity and prevent unwanted reactions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If fluidic levitation is used to process substrates, then substrate contact is minimized and processing quality improves, but lateral motion of the substrate becomes uncontrollable
Solution Approach 1:
A stabilizing structure is introduced as an intermediary element on the substrate that interacts with the fluid flow to provide lateral stability. This structure acts as a mediator between the fluidic levitation force and the substrate, enabling controlled positioning while maintaining contactless processing
Solution Approach 2:
The lateral stability is achieved by changing the parameters of the fluid flow, specifically using orthogonal jets that impinge on the substrate at right angles to the primary levitation flow. This creates a balance of forces that stabilizes the substrate position horizontally while maintaining vertical levitation
2Manufacturing precision
If reactive chemical fluids are used for deposition, then material layer functionality improves, but unwanted reactions on chamber surfaces occur
Solution Approach 1:
The harmful reactive effects are extracted and isolated from the chamber surfaces by directing the reactive chemical fluids only through the orthogonal jets onto the substrate. The chamber surfaces are excluded from the reactive fluid path, preventing unwanted reactions while maintaining the functionality of the deposited material layer
Solution Approach 2:
The reactive chemical fluids are applied locally and selectively only to the substrate surface through the orthogonal jets, rather than being distributed throughout the entire chamber. This localized application ensures that the reactive materials interact only with the substrate where desired functionality is needed, not with the chamber surfaces
3Stability of the object's composition
If orthogonal jets are used to stabilize substrate, then lateral motion is restricted, but device complexity increases
Solution Approach 1:
The fluid flow system is segmented into distinct functional components: a primary levitation flow source and separate orthogonal stabilization jets. This segmentation allows each component to perform its specific function independently, simplifying the control and design of each element while achieving complex overall behavior
Solution Approach 2:
The orthogonal jets serve multiple functions simultaneously: they stabilize the substrate laterally, deliver reactive chemical materials for deposition, and control the fluid flow dynamics. This multi-functionality reduces the need for separate systems for each purpose, thereby reducing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures stable fluidic levitation, reduces substrate defects, and prevents unwanted reactions on chamber surfaces, enabling efficient and uniform atomic layer deposition on substrates.
Implementation Method 1
A pressurized-fluid source provides a fluid flow through the stationary support that impinges on the moveable substrate within the enclosed interior impingement area of the moveable substrate sufficient to levitate the moveable substrate
Implementation Method 2
A pressurized-fluid source provides a fluid flow through the stationary support that impinges on the moveable substrate within the enclosed interior impingement area of the moveable substrate sufficient to levitate the moveable substrate
Data Source
AI summary
A thin film deposition system for depositing a thin film on a moveable substrate using atmospheric pressure atomic-layer deposition includes a chamber and a moveable substrate having a levitation stabilizing structure located on the moveable substrate that defines an enclosed interior impingement area of the moveable substrate. A stationary support, located in the chamber, supports the moveable substrate. The stationary support extends beyond the enclosed interior impingement area. A pressurized-fluid source provides a fluid flow through the stationary support that impinges on the moveable substrate within the enclosed interior impingement area of the moveable substrate sufficient to levitate the moveable substrate and expose the moveable substrate to the fluid while restricting the lateral motion of the moveable substrate with the levitation stabilizing structure.