Levitation Stage Segmented Vacuum for Substrate Transfer Stability

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Solution Overview

Problem

During the fabrication of display devices, substrates with varying thicknesses or warps often experience transfer failures such as slips or misalignment when using conventional levitation stages.

Innovation Solution

The apparatus includes a levitation stage with alternating first and second areas, equipped with rollers, first and second vacuum holes, and controlled pressures. The controller adjusts the pressure based on the substrate's thickness and the type of film formed on it, ensuring stable transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional levitation stage is used to transfer substrates, then the transfer process can be performed, but transfer failures such as slips or misalignment occur when substrates have varying thicknesses or warps

Engineering Contradiction:
Improvetransfer stabilityVSAvoidsubstrate type compatibility
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The levitation stage is divided into multiple areas (first areas and second areas) with different vacuum hole configurations. The first areas have first vacuum holes for substrates without anti-reflective films, while the second areas have second vacuum holes for substrates with anti-reflective films, allowing tailored support for different substrate types

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The vacuum pressure applied to different areas is dynamically adjusted based on substrate characteristics. The controller selectively activates first or second vacuum holes depending on whether the substrate has an anti-reflective film, adapting the transfer mechanism to maintain reliability across varying substrate conditions

Inventive Principle:
Principle #15Dynamics

2Reliability

If uniform vacuum pressure is applied across the levitation stage, then the system structure is simple, but transfer failures occur for substrates with varying thicknesses or warps

Engineering Contradiction:
Improvetransfer stabilityVSAvoidvacuum hole configuration
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The vacuum system is segmented into first vacuum holes and second vacuum holes located in different areas of the levitation stage. This segmentation allows different vacuum pressure applications for different substrate types, improving transfer stability without requiring complete system redesign

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different vacuum characteristics are applied to different local areas of the levitation stage. First areas have first vacuum holes for one type of substrate, while second areas have second vacuum holes for another type, providing localized optimization for various substrate conditions

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables stable transfer of various substrates by optimizing the air pressure control, minimizing transfer failures and ensuring precise positioning during substrate processing.

Implementation Method 1

a plurality of first vacuum holes installed in the first areas and sucking the air at first pressure; and a plurality of second vacuum holes installed in the second areas and sucking the air at second pressure that is different from the first pressure

Methodology Applied
Scientific EffectVacuum: Vacuum

Data Source

PatentUS12269057B2Apparatus and method for processing substrate
Publication Date: 2025.04.08 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US12269057B2 patent drawing
  • US12269057B2 patent drawing
  • US12269057B2 patent drawing

AI summary

An apparatus for processing a substrate is provided. The apparatus includes: a levitation stage transferring a substrate in a first direction and including first areas and second areas, which are arranged in a second direction that is different from the first direction; a plurality of rollers installed in the first areas and transferring the substrate; a plurality of first vacuum holes installed in the first areas and sucking the air at first pressure; and a plurality of second vacuum holes installed in the second areas and sucking the air at second pressure that is different from the first pressure.