LGA Socket Clapboard Protrusions Prevent Contact Interference

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Solution Overview

Problem

Conventional LGA electrical connectors face issues with increasing contact density leading to interference between adjacent contacts and potential damage to IC packages under external force, resulting in unstable electrical connections.

Innovation Solution

The electrical connector features an insulative housing with a mating surface, passageways, and clapboards with protrusions that reduce external forces, preventing interference between contacts and ensuring stable IC placement, using a design with first and second protrusions to prop the IC and cancel external forces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If contact density is increased to meet sophisticated electronic system requirements, then the number of electrical contacts increases, but adjacent contacts interfere with each other due to resilient arms extending upwardly

Engineering Contradiction:
Improvenumber of electrical contactsVSAvoidinterference between adjacent contacts
Core Design Contradiction:
Quantity of substanceVSObject-generated harmful factors

Solution Approach 1:

A clapboard structure is introduced as an intermediary element positioned between adjacent electrical contacts. The clapboard features downward protrusions that extend into the receiving cavity and upward protrusions that contact the IC package, serving as a mediator to prevent contact interference while maintaining high contact density.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The protective structure transitions from a two-dimensional planar arrangement to a three-dimensional configuration with downward protrusions extending into the receiving cavity and upward protrusions contacting the IC package. This dimensional change allows the clapboard to effectively separate adjacent contacts without increasing the footprint area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If protrusions are added to reduce external force on the IC package, then the IC package stability improves, but the device complexity increases

Engineering Contradiction:
ImproveIC package stabilityVSAvoidhousing structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The protective protrusions are merged with the clapboard structure rather than being separate components. The clapboard integrates both the contact-separating downward protrusions and the IC-package-contacting upward protrusions into a single unified element, reducing overall device complexity while maintaining reliability benefits.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The clapboard structure serves multiple functions simultaneously: it separates adjacent electrical contacts to prevent interference, provides mechanical support to the IC package through upward protrusions, and distributes external forces across multiple contact points. This multi-functionality reduces the need for additional separate components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS7377792B2LGA socket connector having housing with upward protective protrusion adjacent contact terminal
Publication Date: 2008.05.27 HON HAI PRECISION INDUSTRY CO LTD
  • US7377792B2 patent drawing
  • US7377792B2 patent drawing
  • US7377792B2 patent drawing

AI summary

An electrical connector comprising an insulative housing defining a mating surface adapted to support an IC package, at least four passageways defined in region within the mating surface and each passageway associated a clapboard arranged between every two adjacent passageways; at least four contacts received in corresponding passageways respectively, each contact including a contact engaging portion extending upwardly above the mating surface and toward the IC; wherein the clapboard has protrusions extending upwardly therefrom along a direction perpendicular to a bottom surface of the IC package seated on the mating surface, the protrusions comprising first protrusions and second protrusions higher than the first protrusions; the first protrusions being arranged between every two adjacent contacts, allowing the engaging portion of the two adjacent contacts without interference when the IC is seated on the mating surface of the housing.