LGA Coupling Pad Vertical Transmission Line Transition
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Solution Overview
Problem
Conventional single chip packages face performance deterioration due to parasitic inductance and heat radiation issues, particularly in RF band circuits, and are costly and difficult to miniaturize for mass production.
Innovation Solution
A single chip package using Land Grid Array (LGA) coupling with a multi-layer substrate and Co-Planar Waveguide (CPW) transmission lines, which minimizes parasitic inductance and enhances heat radiation by direct connection to a mainboard via pads, eliminating the need for additional processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Ball Grid Array (BGA) technology is used to couple substrate with PCB, then electrical connection is achieved, but parasitic inductance increases causing RF performance deterioration
Solution Approach 1:
The patent extracts the harmful ball component from the connection system and replaces it with a pad-based LGA coupling mechanism. The signal transmission path is reconfigured to eliminate the ball, thereby removing the source of parasitic inductance while maintaining electrical connection functionality between the RF substrate and PCB.
Solution Approach 2:
The patent transitions from a three-dimensional ball-based connection (BGA) to a two-dimensional pad-based connection (LGA). This dimensional change allows for direct planar contact between the substrate pad and PCB pad, eliminating the height and associated inductance of the ball while maintaining electrical connectivity.
2Reliability
If additional external processes such as ball forming, ball attaching, ball molding are implemented, then electrical connection is established, but manufacturing complexity and cost increase
Solution Approach 1:
The patent removes the complex ball-based assembly process (ball forming, attaching, molding) from the manufacturing workflow and replaces it with a simplified pad-to-pad LGA coupling process. This extraction of the ball component eliminates multiple external processes while maintaining reliable electrical connection through direct pad contact.
Solution Approach 2:
The LGA coupling structure enables self-alignment and self-connection through the pad geometry and arrangement. The pads are designed to naturally align during PCB assembly, eliminating the need for complex external processes to position and secure balls, thereby simplifying manufacturing while ensuring reliable electrical connection.
3Ease of operation
If ball size and interval are maintained for proper spacing, then signal transmission is enabled, but package size increases
Solution Approach 1:
The patent transitions from three-dimensional ball-based spacing to two-dimensional pad-based spacing. This allows for reduced spacing between connection points since pads can be placed directly adjacent to each other on the same plane, eliminating the need to accommodate ball height and associated clearance, thereby reducing overall package size while maintaining signal transmission capability.
4Reliability
If ground passes through ball for connection, then electrical connection is achieved, but heat radiation capability is reduced
Solution Approach 1:
The patent extracts the ball component that was forcing ground to pass through a narrow path, and replaces it with a pad-based connection that allows for expanded ground contact area. This enables improved heat radiation from the ground pad directly to the PCB ground plane, while maintaining electrical connection through the same LGA coupling mechanism.
Data Source
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AI summary
An apparatus for a single chip package using Land Grid Array (LGA) coupling is provided. The apparatus includes a multi-layer substrate, at least one integrated circuit chip, and a Printed Circuit Board (PCB). The a multi-layer substrate has at least one substrate layer, has at least one first chip region and at least one second chip region in a lowermost substrate layer, configures a transmission line transition of a vertical structure for transmitting a signal from at least one integrated circuit chip coupled in the first chip region in a coaxial shape or in a form of a Co-Planar Waveguide guide (CPW), and has an LGP coupling pad for connecting with a Printed Circuit Board (PCB) in the lowermost layer. The at least one integrated circuit chip is coupled in the first chip region and the second chip region. The PCB is connected with the multi-layer substrate using the LGA coupling via the LGA coupling pad.