LGA Interposer Flexible Circuit for High I/O Density
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Solution Overview
Problem
Current MCM and LGA technologies face limitations in achieving higher I/O densities without increasing the chip module footprint or reducing the pitch of area array I/O contacts beyond practical limits, and there is a need for secure integration of vital product data modules in high-performance electronic modules.
Innovation Solution
The use of flexible circuit structures connected to first level chip module assemblies to increase LGA contact area, allowing higher I/O interconnections without expanding the chip module footprint, and integrating VPD modules into the MCM package in a tamper-resistant manner using a compartment within the metal support frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If LGA area is expanded to achieve higher I/O interconnections, then I/O count increases, but chip module footprint increases
Solution Approach 1:
The patent introduces a flexible circuit that extends the LGA contact area in a spatial dimension beyond the chip module footprint. The flexible circuit acts as an intermediary that carries I/O contacts from the chip module to additional contact areas on the circuit board, effectively utilizing three-dimensional space rather than expanding only the two-dimensional chip module footprint.
Solution Approach 2:
The flexible circuit serves as an intermediary element between the chip module and the circuit board. It contains I/O contacts that mate with contacts on the circuit board, enabling extended I/O interconnections without requiring the chip module itself to occupy a larger footprint. The flexible circuit mediates the connection between the fixed chip module and the expanded LGA area.
2Quantity of substance
If I/O pitch is reduced to achieve higher I/O densities, then I/O count increases, but manufacturing complexity increases
Solution Approach 1:
The patent changes the pitch parameter of the I/O contacts on the flexible circuit to a more practical, larger pitch value. This allows the flexible circuit to be manufactured with standard, less complex processes while still achieving high I/O counts through the extended area provided by the flexible circuit extension rather than through dense packing at the chip module level.
3Reliability
If VPD module is integrated into MCM package, then security is improved, but package complexity increases
Solution Approach 1:
The VPD module is nested within the existing MCM package structure, specifically housed in a cavity formed in the metal support frame. This nesting approach integrates the VPD module into the package without requiring a completely new package design, thereby improving security through integration while minimizing the increase in overall package complexity by utilizing existing structural elements.
Data Source
AI summary
Apparatus and methods are provided for constructing electronic package structures using LGA (land grid array) module-to-board connectors that are designed to provide higher count I/O interconnections by expanding LGA area, but without having to increase chip module footprint or reduce the pitch of area array I/O contacts of an LGA interposer or circuit board beyond practical limits.