Impedance Controlled LGA Interposer Assembly with Ground Shielding

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Solution Overview

Problem

Conventional interposer plates with short, closely spaced contacts experience increased signal impedance and cross-talk at high-frequency signal frequencies, degrading signal strength and reliability in high-speed circuit applications.

Innovation Solution

Incorporating through signal contacts with central impedance coupling sections surrounded by overmolded plastic, which reduces impedance between adjacent signal contacts, and using ground contacts to minimize cross-talk between pairs of signal contacts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If conventional interposer plates with short, closely spaced contacts are used, then a large number of differential pair signal connections can be established, but signal impedance increases and signal strength degrades at high frequencies

Engineering Contradiction:
Improvenumber of signal connectionsVSAvoidsignal strength
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The contact structure is segmented into multiple functional portions: a first contact portion extending from the first surface, a second contact portion extending from the second surface, and a central coupling section connecting them. This segmentation allows each portion to be optimized for its specific function, with the coupling section specifically designed to reduce impedance at high frequencies while the contact portions maintain reliable electrical connections.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different sections of the contact have different geometries and properties tailored to their local functions. The central coupling section has a larger cross-sectional area compared to the contact portions, creating a localized impedance reduction zone. This local quality change allows the contact to maintain low impedance at the critical coupling region while preserving connection integrity at the substrate interfaces.

Inventive Principle:
Principle #3Local quality

2Quantity of substance

If contacts are spaced very close together to establish large number of connections, then connection density increases, but cross-talk between adjacent pairs of signal contacts increases

Engineering Contradiction:
Improveconnection densityVSAvoidcross-talk
Core Design Contradiction:
Quantity of substanceVSObject-generated harmful factors

Solution Approach 1:

Ground contacts serve as intermediary elements positioned between adjacent signal contact pairs. These ground contacts act as shields that electrically isolate the signal pairs from each other, reducing electromagnetic coupling and cross-talk. The ground contacts mediate the electromagnetic field distribution, preventing harmful interference between closely spaced signal connections.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Speed

If high-frequency signals with fast rise times are transmitted through conventional interposer plates, then circuit speed increases, but signal impedance increases and signal quality degrades

Engineering Contradiction:
Improvecircuit speedVSAvoidsignal quality
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The contact geometry parameters are changed, specifically increasing the cross-sectional area of the central coupling section. This parameter change directly affects the electrical characteristics of the contact, reducing its impedance. The modified geometry allows high-frequency signals with fast rise times to pass through with minimal impedance mismatch and signal degradation, maintaining signal quality at high circuit speeds.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS9172161B2Impedance controlled LGA interposer assembly
Publication Date: 2015.10.27 AMPHENOL INTERCON SYSTEMS INC
  • US9172161B2 patent drawing
  • US9172161B2 patent drawing
  • US9172161B2 patent drawing

AI summary

An interposer plate assembly having an insulating plate and metal contacts in the plate with contact points above and below the plate and a central portion in the plate. Two cantilever arms extend from the central portion to each contact point. The central portion may be formed to have a large area to form an impedance shield for reducing impedance between adjacent signal contacts. Plastic bodies may be overmolded on separate contacts or on contact pairs and may have sliding fits in passages of the interposer plate. Contacts may be arranged as differential pairs with ground contacts located between the differential pairs.