LGA Pad Landing Area Layout for Lower Parasitic Capacitance
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Solution Overview
Problem
Existing land grid array (LGA) pads exhibit parasitic capacitance due to their design, which affects the operation of integrated circuits, and there is a need to reduce these capacitances without compromising compatibility with various socket and pin configurations.
Innovation Solution
The LGA pads are dimensioned with an initial landing area that allows a majority of socket pins to land off the pad before actuation and a final landing area that maintains electrical contact after actuation, reducing the overall pad dimensions while ensuring compatibility with different socket designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If LGA pad dimensions are reduced to minimize parasitic capacitance, then parasitic capacitance is reduced, but compatibility with various socket and pin configurations may be compromised
Solution Approach 1:
The LGA pad is segmented into two distinct functional areas: an initial landing area with reduced dimensions to minimize parasitic capacitance, and a final landing area with larger dimensions to ensure reliable electrical contact. This segmentation allows the pad to simultaneously reduce harmful capacitance effects while maintaining compatibility with various socket and pin configurations through the final landing area.
2Object-affected harmful factors
If LGA pad dimensions are reduced, then parasitic capacitance is reduced, but reliable electrical contact may be compromised
Solution Approach 1:
The pad structure is divided into an initial landing area and a final landing area. The initial landing area has reduced dimensions to minimize parasitic capacitance during the insertion phase, while the final landing area provides sufficient surface area to ensure reliable electrical contact after socket actuation, thus resolving the contradiction between capacitance reduction and contact reliability.
Solution Approach 2:
The socket actuation mechanism performs a preliminary action that transitions the pin from an initial position over the reduced initial landing area to a final position over the larger final landing area. This preliminary mechanical action ensures that the pin makes reliable contact with the final landing area after insertion, compensating for the reduced initial landing area dimensions.
Data Source
AI summary
A method for dimensioning a land grid array pad can include forming an initial landing area of a land grid array pad, wherein the initial landing area is dimensioned to cause at least a majority of a landing surface of one or more socket pins to land off of the initial landing area prior to actuation of one or more sockets including the one or more socket pins. The method can also include forming a final landing area of the land grid array pad, wherein the final landing area is dimensioned to maintain electrical contact with the landing surface of the one or more socket pins after actuation of the one or more sockets including the one or more socket pins. Various other methods and systems are also disclosed.