LGA Pad Layout for Shock-Resistant Modular Electronics
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Solution Overview
Problem
Mobile computing devices lack adequate mechanisms to mitigate environmental risks such as stress induced by drops, shocks, and vibrations, particularly for large electronic modules, which also limit their functionality and increase costs due to high pin count and RF connection issues.
Innovation Solution
The implementation of land grid array (LGA) patterns with anchor pads, digital signal arrays, and RF pads on a system on module (SOM) and main logic board (MLB) that provide a rugged, low-impedance RF connection capable of withstanding drops and vibrations while maintaining signal integrity and thermal conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional connection methods are used for electronic modules, then device functionality is limited and costs increase due to high pin count requirements, but environmental risks such as stress from drops and vibrations cannot be adequately mitigated
Solution Approach 1:
The connection structure is segmented into multiple functional zones: center anchor pads for primary mechanical support, corner anchor pads for additional stability, RF pads for radio frequency connections, and digital signal pads for data transmission. This segmentation allows each zone to be optimized for its specific function while collectively providing robust environmental resistance.
Solution Approach 2:
The patent transitions from traditional two-dimensional pin arrays to a three-dimensional pad structure with vertical thickness components. The anchor pads extend through multiple PCB layers, creating a volumetric connection that resists mechanical stress from drops and vibrations while maintaining electrical connectivity.
2Adaptability or versatility
If high pin count connections are used to maintain functionality, then device functionality is preserved, but costs increase and RF connection quality deteriorates
Solution Approach 1:
Different regions of the connection structure have specialized properties: RF pads are positioned and sized to optimize radio frequency performance with proper impedance matching, while digital signal pads are configured for high-speed data transmission. This local optimization allows each pad type to perform its specific function at peak efficiency without compromising overall device functionality.
Solution Approach 2:
The anchor pads serve as intermediary elements that provide both mechanical support and electrical connectivity. They act as a bridge between the module and the main board, stabilizing the connection and reducing stress on the RF and digital signal pads, thereby maintaining signal quality while preserving full device functionality.
3Adaptability or versatility
If modular electronics platforms are implemented, then device functionality and adaptability are improved, but connection stability under stress deteriorates
Solution Approach 1:
The patent merges mechanical support functions and electrical connection functions into a unified pad structure. The anchor pads simultaneously provide structural stability and electrical connectivity, while the integrated layout of RF and digital signal pads ensures that modular components maintain stable connections under environmental stress while preserving adaptability.
4Ease of manufacture
If traditional LGA patterns are used, then manufacturing is simplified, but digital signal disconnection occurs during drops and vibrations
Solution Approach 1:
The anchor pads are positioned and sized to provide preemptive mechanical support that cushions the connection structure against future stress from drops and vibrations. This prior cushioning prevents digital signal disconnection by absorbing mechanical shocks before they can reach the signal pads, while the overall LGA pattern remains manufacturable using standard processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The LGA patterns effectively prevent disconnection of digital signals during drops, ensure RF signal quality, and conduct heat efficiently, all while being cost-effective and suitable for portable devices.
Implementation Method 1
conduct heat efficiently
Data Source
AI summary
Provided are methods, systems, and apparatuses related to modular electronics platforms for mobile computing devices. One such apparatus may include a system on module (SOM) having a first surface that is configured to be coupled electrically to one or more chipsets. The apparatus may include a land grid array (LGA) disposed on a second surface of the SOM. The LGA may include one or more center anchor pads, one or more corner anchor pads, a digital signal array, one or more communications pads, and one or more ground pads. The various pads of the LGA may be configured to be coupled to one or more pads or pins disposed on a surface of a main logic board (MLB).