LGA Socket Standoff Structures for Contact Over-Deflection Control

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Solution Overview

Problem

Existing LGA and HLGA socket designs lack adequate standoff features, leading to socket contact damage during shipping and long-term reliability issues due to contact over-deflection and module laminate creep, especially in densely packed modules with limited space for traditional standoff features.

Innovation Solution

Implement high-definition 3-D printing of standoffs and alignment features on connector housings, combined with terraced module and PWB surfaces, using materials like glass-particle-filled thermoplastics and curable epoxy materials, to create custom standoff placements that minimize dynamic warp behavior and ensure reliable interconnects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional standoff features are used in LGA/HLGA sockets, then module support and alignment are provided, but the socket size increases and density is reduced

Engineering Contradiction:

Improvemodule support and alignmentVSAvoidsocket size

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent applies local quality by transitioning from traditional distributed standoff features to localized support structures positioned precisely where needed. The support structure includes a base layer with recesses that receive module feet, and vertical support elements that provide targeted alignment and support only at critical locations, rather than requiring standoff features across the entire socket surface.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent implements nesting by integrating the support structure directly into the socket housing. The base layer with recesses is formed within the housing structure, and support elements are positioned within these recesses, creating a nested configuration where the support functionality is embedded within the existing socket geometry, minimizing additional space requirements.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

If standoff features are added to prevent contact over-deflection, then contact reliability improves, but manufacturing complexity increases

Engineering Contradiction:

Improvecontact reliabilityVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the support structure with the socket housing by forming the base layer with recesses as an integrated component. The support elements are positioned within these recesses and work together with the housing to provide contact support, eliminating the need for separate, independently manufactured standoff features and reducing overall manufacturing complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent changes the structural parameters of the socket housing by incorporating recesses of specific depths and configurations that directly control contact deflection characteristics. By modifying the housing geometry itself rather than adding separate standoff components, the patent achieves contact protection while simplifying the manufacturing process.

Inventive Principle:

Principle #35Parameter changes

3Area of stationary object

If module size is reduced for smaller chip configurations, then device density increases, but adequate support and alignment become more difficult to provide

Engineering Contradiction:

Improvemodule sizeVSAvoidsupport and alignment adequacy

Core Design Contradiction:

Area of stationary objectVSReliability

Solution Approach 1:

The patent applies local quality by providing highly localized support through precisely positioned recesses in the base layer that receive module feet. The vertical support elements are positioned exactly where alignment is needed, concentrating support functionality at critical points rather than distributing it across a larger area, which is essential for supporting smaller modules with limited space.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent replaces traditional mechanical standoff features with a recess-based support system. The recesses in the base layer provide mechanical support and alignment through geometric constraints rather than through elevated standoff structures, enabling adequate support for smaller modules without requiring additional space.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS12439542B2Standoff and support structures for reliable land grid array and hybrid land grid array interconnects

Publication Date: 2025.10.07 INTERNATIONAL BUSINESS MACHINE CORPORATION

AI summary

Disclosed herein is a method for producing a land grid array (LGA) socket connector assembly and the resultant assembly. The method comprises providing a carrier having a first carrier thickness with an array of vias, each having a first diameter, providing pockets around top surfaces of the vias, each having a second diameter and creating a portion of the pockets having a second carrier thickness that is less than the first carrier thickness, providing socket contact springs, each comprising a hole support structure that supports the socket contact spring within the via, and a contact beam configured to contact a conductor of an integrated circuit to be placed within the socket connector assembly, wherein a portion of carrier having a first carrier thickness is configured to prevent the contact beam from inelastically deforming when bent under load. Alternately, a contact feature may be used to prevent the inelastic deformation.