Pluggable LGA Socket Thermal Wedge for MCM Heat Dissipation
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Solution Overview
Problem
Conventional pluggable connectors for optical-to-electrical transceivers face challenges in heat dissipation due to their large size, which occupies valuable surface area on multi-chip modules (MCMs), limiting the configuration and accessibility of densely populated electronic components.
Innovation Solution
The implementation of thermally conductive wedges positioned above a pluggable optical-to-electrical transceiver within a channel housing creates a Z-motion socket contact actuation and thermal heat dissipation path, enhancing both electrical connections and thermal management by allowing heat to be transferred to air-cooled fins or other cooling devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional pluggable connectors are used for optical-to-electrical transceivers, then reliable electrical connections are established, but the large connector size occupies valuable surface area on the MCM and creates high thermal impedance for heat removal
Solution Approach 1:
The patent transitions from traditional orthogonal insertion to coplanar edge insertion, changing the dimensional approach of connector integration. The LGA socket and module are positioned at the edge of the MCM in a coplanar arrangement, allowing connectors to be accessed from the side rather than occupying premium top-surface area, thus resolving the contradiction between connection reliability and surface area consumption
2Temperature
If conventional pluggable connectors with larger heat removal area are used, then thermal impedance is reduced, but the physical device size increases and consumes more valuable MCM surface area
Solution Approach 1:
The patent introduces a dedicated heat sink component as an intermediary element that couples thermally to the transceiver module. This separate heat management component provides an efficient thermal pathway without requiring the main connector structure to be enlarged, thus improving heat removal efficiency while maintaining compact connector dimensions and preserving MCM surface area
3Reliability
If orthogonal insertion method is used for LGA connectors, then reliable electrical connections are established through cantilever deformation, but board removal or open drawer access is required for field connections
Solution Approach 1:
The patent changes the insertion dimension from orthogonal (vertical) to coplanar (horizontal/edge-parallel). The LGA module and socket are arranged at the edge of the board with contacts extending along the edge, enabling side-access insertion and removal. This dimensional change allows field service personnel to access and replace modules by simply sliding them out from the board edge without requiring board removal or complex drawer mechanisms, thus improving ease of operation while maintaining connection reliability through the LGA contact mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a high-density, thermally efficient path for heat dissipation, maintaining reliable electrical connections while minimizing the physical footprint on the MCM, thus addressing the thermal impedance and space constraints of conventional connectors.
Implementation Method 1
a tapered opening remains or is created between an upper portion of the channel housing above the electrical-to-optical transceiver, wherein a gap of the tapered opening decreases progressively starting from the opening. The method includes inserting a conductive wedge or wedges into the gap of the tapered opening
Data Source
AI summary
Embodiments provide for a method for pluggable Land Grid Array (LGA) socket for high density interconnects. A method includes inserting an electrical-to-optical transceiver into an opening of a channel housing that is positioned above a land grid array connector located on an electrical package. After the electrical-to-optical transceiver is inserted into the channel housing, a tapered opening remains between an upper portion of the channel housing above the electrical-to-optical transceiver, wherein a gap of the tapered opening decreases progressively starting from the opening. The method includes inserting a conductive wedge into the gap of the tapered opening prior to communications through the electrical-to-optical transceiver between a component on the electrical package and a component external to the electrical package.