LCD Backlight LGP Support Polygon Frame Heat Dissipation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Large-sized liquid crystal display (LCD) modules face challenges with heat dissipation due to increased dimensions and decreased thickness, leading to deteriorated image quality, and require a more efficient mounting structure to reduce weight and thickness while maintaining stability.

Innovation Solution

The implementation of a light guide plate (LGP) support with a polygon frame shape and interconnecting pieces using friction stir welding (FSW) technology, which forms a closed square structure with a reflector for effective heat dissipation and reduced weight, and an LCD module mounting member with a high heat transfer coefficient for efficient thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If the number of light sources is increased to illuminate larger LCD modules, then the light output is improved, but the heat generation increases and deteriorates image quality

Engineering Contradiction:
Improvelight outputVSAvoidheat generation
Core Design Contradiction:
Illumination intensityVSTemperature

Solution Approach 1:

The patent applies this principle by converting the harmful thermal energy generated by light sources into a beneficial cooling mechanism. The heat dissipation member is positioned to receive thermal energy from the light sources and dissipate it through its structure, transforming the harmful heat into a controlled thermal management system that prevents image quality deterioration while maintaining high light output

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

2Length of moving object

If the thickness of the LCD module is decreased to make it thinner, then the compactness is improved, but the thermal path is narrowed and heat dissipation becomes insufficient

Engineering Contradiction:
ImprovethicknessVSAvoidheat dissipation
Core Design Contradiction:
Length of moving objectVSTemperature

Solution Approach 1:

The patent applies this principle by transitioning from one-dimensional heat dissipation (through the thin module thickness) to three-dimensional heat dissipation. The heat dissipation member extends in multiple directions and utilizes its entire volume for thermal management, allowing effective heat dissipation even when the module thickness is minimized for compactness

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Stability of the object's composition

If a closed-type bottom container is used to support the backlight assembly, then the structural stability is improved, but the overall depth and weight of the LCD module increase

Engineering Contradiction:
Improvestructural stabilityVSAvoidmodule weight
Core Design Contradiction:
Stability of the object's compositionVSWeight of stationary object

Solution Approach 1:

The patent applies this principle by replacing the rigid closed-type bottom container with a thin-film heat dissipation member that provides structural support through its thermal management function. This thin film structure maintains the necessary structural stability for supporting the backlight assembly while dramatically reducing the overall depth and weight compared to traditional closed container structures

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances heat dissipation, reduces the overall size and weight of the LCD device, improves image quality, and simplifies the mounting structure for increased stability and reliability.

Implementation Method 1

interconnecting pieces using friction stir welding (FSW) technology

Methodology Applied
Scientific EffectFriction stir welding: Friction Welding

Implementation Method 2

LCD module mounting member with a high heat transfer coefficient for efficient thermal management

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS9046635B2Backlight assembly, and liquid crystal display module and liquid crystal display device having the same
Publication Date: 2015.06.02 SAMSUNG DISPLAY CO LTD
  • US9046635B2 patent drawing
  • US9046635B2 patent drawing
  • US9046635B2 patent drawing

AI summary

A liquid crystal display (“LCD”) module includes a backlight assembly emitting light, a LCD panel overlapping the backlight assembly, and an upper cover. The backlight includes a light source module emitting the light, a light guide plate (“LGP”) including edges and a middle portion, and a LGP support overlapping the edges of the LGP. The LGP support includes a plurality of LGP supporting pieces connected to each other so as to form a polygonal shape, each of the LGP supporting pieces including a LGP supporting portion including a LGP supporting surface overlapping the edges of the LGP, and the LGP supporting surfaces of each of the LGP supporting pieces of the LGP support are placed on a same plane. Opposing LGP supporting pieces are interconnected by an LCD module mounting member.