Lid-Bonded Electronic Package Assembly for Smaller Reliable Packaging
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Solution Overview
Problem
Existing electronic packages and manufacturing methods are inadequate, leading to excess cost, decreased reliability, and large package sizes.
Innovation Solution
A method involving a substrate with a dielectric and conductive structure, a first electronic component coupled with a conductive structure, an encapsulant covering the lateral side, a lid, and an adhesive between the electronic component and the lid, along with a manufacturing process that includes providing a lid with adhesive, an electronic component, and a substrate over the encapsulant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of stationary object
If conventional electronic packages and manufacturing methods are used, then manufacturing experience is gained, but package size becomes too large, cost increases, and reliability decreases
Solution Approach 1:
The electronic component is divided into two functional sides: a first side with input/output terminals for signal input, and a second side with embedded terminals for signal output. This segmentation allows each side to be optimized independently, reducing overall package size while maintaining reliability through dedicated terminal configurations for each function
Solution Approach 2:
The patent transitions from conventional two-dimensional surface mounting to three-dimensional integration by embedding terminals within the electronic component body. This dimensional change allows terminals to be positioned inside the component rather than only on the surface, reducing package size while improving signal integrity and reliability
2Ease of manufacture
If conventional electronic packages are used, then manufacturing simplicity is maintained, but cost increases and performance decreases
Solution Approach 1:
Input/output terminals and embedded terminals are pre-formed on the first and second sides of the electronic component during component fabrication, before assembly into the final package. This preliminary action simplifies the manufacturing process by eliminating subsequent terminal formation steps and enables more efficient assembly operations
Solution Approach 2:
The patent combines multiple functions into a single integrated electronic component structure: the component body houses both input/output terminals and embedded terminals, encapsulants provide both protection and electrical isolation, and the lid serves as both a protective cover and a mounting surface for external components
Data Source
AI summary
In one example, an electronic device comprises a substrate comprising a top side, a bottom side, a dielectric structure, and a conductive structure, a first electronic component over the top side of the substrate and coupled with the conductive structure, wherein the first electronic component comprises a first side facing the substrate and a second side facing away from the substrate, an encapsulant over the top side of the substrate and covering a lateral side of the first electronic component, a lid over the top side of the substrate and over the first electronic component, and an adhesive between the second side of the first electronic component and an inner side of the lid. Other examples and related methods are also disclosed herein.