Heat-Dissipating Lid Module With Vapor Chamber for 3D IC Cooling
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Solution Overview
Problem
The increased device density in advanced integrated circuits (ICs) leads to higher power density, posing a significant challenge for thermal management and heat dissipation in IC packaging technologies.
Innovation Solution
A heat-dissipating lid module is introduced, comprising a liquid cooling system thermally coupled to a vapor chamber, with a heat sink base plate acting as the vapor chamber top wall, and incorporating thermoelectric coolers to enhance phase change processes, eliminating thermal resistance and improving conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple ICs are vertically stacked in 3D packages to reduce footprint and power consumption, then device density and power efficiency are improved, but thermal dissipation capability deteriorates due to increased heat generation in confined spaces
Solution Approach 1:
The patent transitions from traditional planar heat dissipation to three-dimensional thermal management by stacking heat dissipation components vertically. The lid module incorporates a vapor chamber positioned above the IC package with heat dissipation fins extending upward, utilizing the vertical dimension to increase heat dissipation surface area without expanding the package footprint, thereby resolving the contradiction between high device density and effective thermal dissipation.
Solution Approach 2:
The patent employs a vapor chamber that utilizes phase transition of working fluid between liquid and vapor states to enhance heat transfer efficiency. The fluid absorbs heat from the IC package bottom, evaporates to transfer latent heat, then condenses on the upper surface to release heat to the lid structure, providing high-efficiency thermal management for densely packed 3D IC configurations.
2Area of stationary object
If more components are packed into smaller areas to reduce footprint, then area efficiency is improved, but thermal management capability worsens due to increased power density
Solution Approach 1:
The patent addresses the area efficiency versus power density contradiction by extending heat dissipation structures into the vertical dimension. The lid module with integrated vapor chamber and fins provides substantial heat dissipation surface area above the compact package, enabling effective thermal management of high power density components without increasing the package footprint.
Solution Approach 2:
The patent introduces a lid module as an intermediary thermal management system between the IC package and the external environment. This intermediate structure includes a vapor chamber that interfaces with the package bottom and heat dissipation fins that interface with ambient air, effectively mediating heat transfer from the compact high-density package to the surrounding environment.
3Ease of manufacture
If traditional heat dissipation structures are used with separate attachment layers, then manufacturing simplicity is maintained, but thermal conductivity deteriorates due to additional thermal resistance from interface materials
Solution Approach 1:
The patent merges the vapor chamber top wall with the heat dissipation fin base into a single integrated structure, eliminating the need for separate attachment materials and interfaces. This integration removes additional thermal resistance layers that would otherwise be required to connect the vapor chamber to the fins, significantly improving thermal conductivity while maintaining manufacturing feasibility through integrated fabrication processes.
Solution Approach 2:
The lid module serves multiple functions simultaneously: it provides structural enclosure for the package, acts as a thermal interface between the vapor chamber and ambient air, and serves as a mounting structure for heat dissipation fins. This multi-functionality eliminates the need for separate specialized components and attachment materials, improving thermal conductivity while maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves enhanced thermal conductivity and efficient heat dissipation by reducing thermal resistance and accelerating phase change processes, effectively managing heat generated by ICs.
Implementation Method 1
A heat-dissipating lid module is introduced, comprising a liquid cooling system thermally coupled to a vapor chamber, with a heat sink base plate acting as the vapor chamber top wall, and incorporating thermoelectric coolers to enhance phase change processes
Implementation Method 2
A heat-dissipating lid module is introduced, comprising a liquid cooling system thermally coupled to a vapor chamber
Implementation Method 3
incorporating thermoelectric coolers to enhance phase change processes
Data Source
AI summary
An exemplary package structure includes a package substrate; an integrated circuit (IC) package comprises one or more dies and having a first side and a second side opposite the first side, wherein the first side of the IC package is attached to the package substrate; a heat-dissipating lid module attached to the second side of the IC package, wherein the heat-dissipating lid module comprises an upper portion, a lower portion, and a middle portion disposed between and thermally coupled to the upper portion and the lower portion, wherein the middle portion includes a heat sink separating the heat-dissipating lid module into a liquid cooling system and a vapor chamber.