Lid-Mounted Amplifier Node Housing for Broadband Networks
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Solution Overview
Problem
Existing broadband distribution network node housings, such as those in cable television networks, face issues where the removal of amplifier circuitry for maintenance or upgrades disrupts power distribution to downstream nodes, leading to service disruptions and inefficient heat dissipation due to the power supply being integrated with the amplifier in a single unit.
Innovation Solution
A node housing design where the amplifier is mounted on a lid portion, allowing for decoupling without disrupting power distribution, and featuring a base with a power supply and increased thermal isolation and heat dissipation through larger internal volumes and heat sink structures, enabling higher power consumption without active cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the amplifier circuitry is integrated with the power supply in a single unit, then the device complexity is reduced, but the reliability deteriorates because removal of amplifier circuitry for maintenance disrupts power distribution to downstream nodes
Solution Approach 1:
The patent divides the integrated unit into separate modular components: the amplifier circuitry is mounted on a lid portion while the power supply remains in the base portion. This segmentation allows the amplifier to be removed for maintenance without disrupting power distribution to downstream nodes, thus maintaining reliability while preserving manageable device complexity through modular architecture.
2Ease of operation
If the amplifier is mounted in the base portion close to coaxial cable receptacles, then the ease of operation is improved for signal coupling, but the temperature increases due to poor heat dissipation
Solution Approach 1:
The patent extracts the amplifier circuitry from the base portion and mounts it on the lid portion. This extraction maintains ease of operation through proximity to coaxial cable receptacles via RF connector ports and interconnects, while simultaneously improving heat dissipation by positioning the amplifier in the lid portion which has larger internal volumes and dedicated heat sink structures.
3Device complexity
If the power supply is integrated with the amplifier in a single unit, then the device complexity is reduced, but the productivity deteriorates because any amplifier maintenance requires complete node disassembly
Solution Approach 1:
The patent segments the amplifier and power supply into separate modular units mounted on different portions (lid and base respectively). This segmentation enables independent access and maintenance of the amplifier through the lid portion without requiring disassembly of the entire node, significantly improving productivity while maintaining manageable device complexity through standardized modular interfaces.
4Temperature
If the amplifier is mounted on the lid portion with larger internal volumes, then the temperature is reduced through improved heat dissipation, but the device complexity increases due to distributed component placement
Solution Approach 1:
The patent extracts the amplifier from the base portion and positions it on the lid portion which provides larger internal volumes for heat dissipation. While this extraction increases device complexity through distributed component placement, the complexity is managed through standardized mounting interfaces and RF connector ports that maintain electrical connectivity, achieving superior thermal performance with controlled complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables maintenance and upgrades without service disruptions and allows for increased power consumption up to 80 watts while maintaining internal temperatures below 85°C through passive cooling, supporting bandwidths of 1.8 GHz and beyond.
Implementation Method 1
allowing for increased power consumption up to 80 watts while maintaining internal temperatures below 85°C through passive cooling
Implementation Method 2
maintaining a target operational temperature within the node housing
Data Source
AI summary
An aspect of the present disclosure includes a node housing for use in a broadband distribution network that includes coupling the amplifier to a lid portion and providing an interface plate in a base portion that allows for RF and power signals to be provided to the RF amplifier within the lid portion. The interface plate disposed within the base portion further preferably provides power pass-through to downstream nodes that remains electrically connected even when the amplifier is decoupled from the lid portion. Thus, the amplifier and/or lid portion may be decoupled from the base portion without disrupting power distribution to the down-stream nodes.