Semiconductor Package Lid Opening Layout for Warpage and Thermal Path
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Solution Overview
Problem
Existing flip-chip package structures face challenges with package warpage and thermal dissipation due to complex fabrication processes, which are not adequately addressed by current methods.
Innovation Solution
A semiconductor package structure with a ring-type or cap-type lid structure that includes openings or recesses for electronic components, enhancing structural strength and allowing direct heat sink contact with semiconductor dies, while using a cooling material for improved thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a complex fabrication process is used to achieve miniaturization and multi-functionality, then device functionality and speed are improved, but package warpage increases
Solution Approach 1:
The package structure is segmented into distinct functional layers including lid structure, encapsulating layer, semiconductor die, and heat sink, allowing each component to be optimized independently for its specific function while reducing overall warpage
Solution Approach 2:
The package employs composite material structures with different thermal and mechanical properties in each layer, creating a multi-material system that balances thermal dissipation requirements with mechanical stability to prevent warpage
2Adaptability or versatility
If a complex fabrication process is used to achieve miniaturization and multi-functionality, then device functionality and speed are improved, but thermal dissipation becomes problematic
Solution Approach 1:
The heat dissipation function is extracted from the traditional package structure by introducing a dedicated heat sink component that is thermally coupled to the semiconductor die, separating the thermal management function from the structural encapsulation function
Solution Approach 2:
A thermal interface material or bonding layer acts as an intermediary between the semiconductor die and heat sink, facilitating efficient heat transfer while accommodating thermal expansion differences between materials
3Strength
If the lid structure is made wider to improve structural strength, then package warpage is reduced, but the area available for electronic components decreases
Solution Approach 1:
The lid structure utilizes three-dimensional depth and vertical positioning to provide structural strength through increased thickness and layered construction, rather than relying solely on increasing the horizontal footprint area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces package warpage and enhances thermal dissipation, offering improved structural integrity and performance by increasing the width of the lid structure and providing a thermal path for heat dissipation.
Implementation Method 1
a heat sink covering the lid structure and the semiconductor die
Data Source
Figure 1
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AI summary
A semiconductor package structure including a package substrate, at least one semiconductor die, a lid structure, a first electronic component and a heat sink is provided. The package substrate has a first surface and a second surface opposite to the first surface. The semiconductor die is on the first surface of the package substrate and is surrounded by an encapsulating layer. The lid structure surrounds and is spaced apart from the encapsulating layer. The lid structure includes a first opening that is covered by the first surface of the package substrate. The first electronic component is over the first surface of the package substrate and arranged within the first opening of the lid structure. The heat sink covers the lid structure and the semiconductor die.