Lid Protrusion for Flatness and Heat Dissipation
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Solution Overview
Problem
Conventional electronic devices face issues with lid tilting during attachment to substrates due to variations in heat dissipation paste thickness, leading to adhesion failures and compromised heat dissipation characteristics, especially when components of different heights are mounted.
Innovation Solution
The introduction of a protrusion portion on the flange portion of the lid, which serves as a supporting point to prevent tilting and ensure uniform adhesive spread, maintaining parallelism between electronic components and the lid's cover portion, thereby controlling heat dissipation paste thickness and enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation paste is applied to ensure sufficient thickness for heat dissipation, then heat dissipation performance is improved, but the lid tilts due to variation in paste height
Solution Approach 1:
The flange portion is designed with differentiated local structures: a first area that contacts the substrate for adhesion, and a second area (protrusion portion) that protrudes to contact the heat dissipation paste. This local quality differentiation allows the lid to maintain both heat dissipation performance and flatness by selectively interacting with different features at different locations.
2Reliability
If the lid adheres to the substrate through adhesive, then adhesion is achieved, but adhesion failure occurs when the lid tilts and the interval becomes wide
Solution Approach 1:
The protrusion portion acts in advance to prevent tilting by contacting the heat dissipation paste before the lid can tilt. This preliminary anti-action counteracts the potential harmful effect of tilting before it occurs, maintaining the interval within the adhesive's effective spreading range and preventing adhesion failure.
3Adaptability or versatility
If electronic components of different heights are mounted on the substrate, then component integration is achieved, but the lid tilts against the substrate
Solution Approach 1:
The flange portion features a protrusion portion that locally contacts the heat dissipation paste, creating a reference plane that compensates for height variations of underlying electronic components. This local quality approach allows the lid to maintain flatness despite diverse component heights below.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration secures reliable adhesion and improves heat dissipation characteristics by maintaining the lid's flatness and ensuring consistent contact between the heat dissipation paste and the lid, even with components of varying heights, thus meeting product specifications.
Implementation Method 1
a flange portion arranged at the periphery of the cover portion and adhered to the substrate
Implementation Method 2
the heat dissipation paste 12 contacts the electronic components and the lid 50 when the lid 50 is attached to the substrate 2
Data Source
AI summary
The present invention can prevent a lid from tilting when the lid is attached to a substrate. An electronic device 200 includes: a substrate 202; an electronic component mounted on the substrate 202; and a lid 100 including a cover portion 102 protruding in a direction opposite the substrate 202 and covering the electronic component and a flange portion 104 arranged at the periphery of the cover portion 102 and adhered to the substrate 202. A protrusion portion 106 protruding for a predetermined height in a direction of the substrate 202 compared to other areas of the flange portion 104 is arranged on the flange portion 104 of the lid 100.