Semiconductor Package Lid Slit and Heat Pipe Thermal Isolation
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Solution Overview
Problem
In 2.5D semiconductor packages, thermal management is challenging due to thermal coupling between IC chips with different power dissipation levels, leading to overheating and potential device failure.
Innovation Solution
A slit is formed through the semiconductor package lid at the boundary between IC chips to prevent heat flow, and vertical heat pipes are inserted through co-axial holes in the lid and heat sink for direct thermal contact with IC chips, ensuring effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple IC chips are mounted close together in a 2.5D package, then performance and bandwidth are improved, but thermal coupling between chips increases causing overheating
Solution Approach 1:
The lid is segmented by forming slits that divide it into separate thermal zones corresponding to each IC chip. These slits create thermal barriers that prevent heat from one chip from coupling to adjacent chips, while the lid still provides mechanical support and thermal path to heat sink for each chip independently.
Solution Approach 2:
The thermal management solution applies different thermal conductivity properties to different regions of the lid. Areas above IC chips maintain high thermal conductivity for heat dissipation, while regions corresponding to slit locations have reduced thermal conductivity to block thermal coupling between adjacent chips.
2Loss of energy
If a traditional heat sink with fins is used, then heat dissipation is provided, but thermal interaction between adjacent IC chips continues due to heat flow through the heat sink
Solution Approach 1:
The harmful thermal coupling path through the heat sink is extracted and eliminated by replacing the traditional fin-based heat sink with vertical heat pipes that provide dedicated, isolated thermal paths from each IC chip directly to the heat sink base, preventing heat flow between adjacent chips through the heat dissipation structure.
Solution Approach 2:
Vertical heat pipes are introduced as intermediary thermal conduction elements between each IC chip and the heat sink. These heat pipes provide efficient heat transfer from chips to the heat sink while their vertical orientation and direct contact configuration prevent lateral heat flow that would cause thermal coupling between adjacent chips.
3Temperature
If slits are formed through the lid to reduce thermal coupling, then thermal interaction between chips is reduced, but the lid structure becomes more complex
Solution Approach 1:
The lid is segmented by forming slits that divide it into separate thermal zones corresponding to each IC chip. These slits create thermal barriers that prevent heat from one chip from coupling to adjacent chips, while the lid still provides mechanical support and thermal path to heat sink for each chip independently.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces thermal interaction between IC chips, enables faster heat dissipation, and results in a smaller and lighter thermal solution size, effectively addressing the overheating issue in semiconductor packages.
Implementation Method 1
at least one vertical heat pipe in direct thermal contact with an IC chip and a heat sink
Implementation Method 2
A heat sink 117 is formed over the lid 111
Data Source
AI summary
A method of reducing heat flow between IC chips and the resulting device are provided. Embodiments include attaching plural IC chips to an upper surface of a substrate; forming a lid over the IC chips; and forming a slit through the lid at a boundary between adjacent IC chips.