Lid With Targeted Flexibility Zones For Thermal Interface Material Peeling
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Solution Overview
Problem
In semiconductor packaging, closely packed chips face challenges with thermal interface material peeling at inner edges, leading to structural integrity issues and potential catastrophic failure due to ineffective heat dissipation, especially as chip size increases.
Innovation Solution
A lid with targeted flexible zones is designed to reduce peeling strain of the thermal interface material by incorporating hinges or slots that provide reduced bending rigidity, ensuring better conformation and structural support to the multi-chip module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chips are packed closely together to increase integration, then productivity and space utilization are improved, but thermal interface material peeling occurs at inner edges leading to structural integrity issues
Solution Approach 1:
The lid is designed with non-uniform thickness, creating regions of different flexibility. Specifically, the lid includes a first region with greater thickness (higher rigidity) and a second region with lesser thickness (higher flexibility) positioned over the gap between chips. This local variation in quality allows the lid to provide structural support where needed while accommodating thermal expansion and preventing TIM peeling in critical areas.
Solution Approach 2:
The patent changes the physical parameter of lid thickness to create targeted flexibility zones. By varying the thickness parameter across different regions of the lid, the design achieves differential rigidity that prevents TIM peeling while maintaining overall structural integrity. The thinner second region allows controlled deformation to accommodate thermal stresses.
2Strength
If a rigid lid is used to provide structural support, then strength is improved, but peeling strain of thermal interface material increases due to lack of flexibility
Solution Approach 1:
The lid incorporates regions of different thickness to create localized flexibility zones. The first region with greater thickness provides structural strength, while the second region with lesser thickness positioned over chip gaps provides flexibility to reduce TIM peeling strain. This spatial differentiation of mechanical properties resolves the contradiction between overall strength and local flexibility.
Solution Approach 2:
The lid is segmented into functional zones with different thickness characteristics. The segmentation creates distinct mechanical behavior zones: a stronger first region for structural support and a more flexible second region for stress accommodation. This segmentation allows the single lid component to simultaneously provide both strength and flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the peeling effect of thermal interface materials, enhancing the structural integrity and heat transfer efficiency between chips and the lid, thereby preventing module buckling and improving reliability.
Implementation Method 1
a lid in contact with the thermal interface material and having a zone of targeted flexibility spaced from the semiconductor device
Implementation Method 2
The chip generates heat when powered in operation. Thermal management of the package may require some type of thermal management mechanism mounted to the chip to extract and dissipate the generated heat
Data Source
AI summary
An electronic apparatus that includes a semiconductor device; an electronic packaging substrate for receiving the semiconductor device; a thermal interface material on the semiconductor device; and a lid in contact with the thermal interface material and having a zone of targeted flexibility spaced from the semiconductor device.