Semiconductor Laser Lid Portion Thickened Lower Surface
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Solution Overview
Problem
Semiconductor laser modules face issues where the optical isolator, fixed to a base with adhesive, tends to peel off due to reduced distance between the optical isolator and the lid portion, especially during package downsizing.
Innovation Solution
A lid portion with a thick portion on its lower surface, positioned to increase strength and determine the lid's position relative to the package, ensuring the optical isolator remains securely attached to the base by maintaining a sufficient distance and magnetic force strength over adhesive strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the package size is reduced, then the productivity and compactness of the semiconductor laser module is improved, but the optical isolator peels from the base due to decreased distance between the optical isolator and lid portion
Solution Approach 1:
The lid portion is segmented into a main body portion and a thick portion, where the thick portion is provided on the lower surface at positions other than directly above the optical isolator. This segmentation allows the lid to provide structural support and maintain spacing without interfering with the optical isolator's attachment to the base.
Solution Approach 2:
The thick portion of the lid acts as an intermediary structural element that determines the position of the lid with respect to the package while maintaining sufficient distance between the optical isolator and lid portion. This intermediary structure prevents direct interaction that would cause peeling.
2Length of stationary object
If the distance between the optical isolator and lid portion is reduced, then the compactness is improved, but the magnetic force strength over adhesive strength is compromised causing peeling
Solution Approach 1:
The lid portion has different local qualities: the main body portion provides sealing and structural support, while the thick portion specifically determines lid position and maintains spacing. This local differentiation allows compact design while preserving the optical isolator's attachment strength.
3Strength
If the thick portion is positioned directly above the optical isolator, then the lid strength is improved, but the optical isolator may be attracted to the lid causing peeling from the base
Solution Approach 1:
The thick portion is extracted from the main body portion and positioned on the lower surface at locations other than directly above the optical isolator. This extraction ensures that the lid maintains sufficient strength while avoiding magnetic attraction to the optical isolator, preventing peeling.
Data Source
AI summary
A lid portion, that is mounted on a package that houses an optical isolator at a certain position, includes: a main body portion that is in contact with an upper end portion of a sidewall of the package; and a thick portion that is provided on a lower surface of the main body portion and determines a position of the lid portion with respect to the package. Further, the thick portion is provided on the lower surface other than a lower surface region of the main body portion, the lower surface region being directly above the optical isolator housed in the package when the lid portion is mounted on the package.