Lid Trenches for Semiconductor Heat Dissipation
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Solution Overview
Problem
The semiconductor industry faces challenges in heat dissipation efficiency as the integration density of electronic components increases, requiring more effective heat dissipation mechanisms in compact packaging technologies.
Innovation Solution
The formation of trenches on the surface of a lid in a semiconductor package structure increases the contact surface area between the thermal interface material (TIM) and the lid, reducing absolute thermal resistance and enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the integration density of electronic components is increased, then more components can be integrated into a given area, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent introduces trenches on the lid surface to transform the two-dimensional contact interface into a three-dimensional structure with increased surface area. The trenches extend vertically into the TIM layer, creating additional heat transfer pathways and effectively adding dimensional complexity to the heat dissipation interface, thereby resolving the heat dissipation bottleneck caused by high integration density.
Solution Approach 2:
The lid with trenches creates a porous-like structure on its surface, where the trenches act as voids or channels that increase the effective surface area for heat transfer. This porous structure allows the TIM to penetrate deeper and create more extensive thermal contact, improving heat dissipation efficiency without increasing the horizontal footprint, thus accommodating higher integration density.
2Loss of energy
If the contact surface area between TIM and lid is increased, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The lid surface is segmented into multiple trenches rather than using a single large contact area. These trenches divide the thermal interface into discrete segments that collectively provide increased surface area. This segmentation approach achieves enhanced heat dissipation while maintaining manufacturing feasibility, as the trenches can be created using standard lithography and etching processes without requiring complex assembly steps.
3Loss of energy
If higher thermal conductivity TIM is used, then heat dissipation efficiency is improved, but manufacturing cost increases
Solution Approach 1:
The patent changes the geometric parameters of the thermal interface by introducing trenches with specific dimensions (depth, width, spacing). This parameter change increases the effective surface area and improves heat dissipation efficiency. The benefit is that lower-cost TIM materials can achieve the same thermal performance as expensive high-conductivity TIM would provide in a flat configuration, thereby reducing material costs while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation efficiency by reducing thermal resistance by up to 40% and allows for the use of lower-cost TIM with lower thermal conductivity, while maintaining effective heat transfer.
Implementation Method 1
the TIM fills the trenches formed on the surface of the lid... reducing absolute thermal resistance and enhancing heat dissipation efficiency
Data Source
AI summary
Embodiments of a lid covering a device die improving heat dissipation for a die package are described. Trenches are formed on the bottom side of a lid to increase surface area for heat dissipation. Various embodiments of the trenches on the lid are described. The layout and design of the trenches could be optimized to meet the heat dissipation need of the device die(s). By using the lid with trenches, heat dissipation efficiency is improved and the amount of thermal interface material (TIM) could be reduced. In addition, the selection of thermal interface materials for the lid is widened.