Lidar Emitting Chamber Heat Dissipation for PCB Overheating

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Solution Overview

Problem

Lidar devices face reliability issues due to heat accumulation in the emitting chamber, which affects the lifetime of laser emitters and performance, as heat dissipation is inefficient in closed structures.

Innovation Solution

Implementing a film-shaped first heat dissipation component with thermally conductive assemblies on the printed circuit board, connected to different chamber walls, to distribute heat uniformly and enhance dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a closed structure is used for the lidar housing, then the structural integrity and protection of components are improved, but heat dissipation efficiency deteriorates

Engineering Contradiction:

Improvestructural integrityVSAvoidheat dissipation efficiency

Core Design Contradiction:

StrengthVSTemperature

Solution Approach 1:

The heat dissipation system is segmented into multiple independent heat dissipation components, each attached to different chamber walls. This segmentation allows heat to be dissipated through multiple pathways simultaneously, maintaining the closed structural integrity while improving heat dissipation efficiency.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heat dissipation components extend in multiple spatial dimensions from the printed circuit board, with each component oriented toward different chamber walls. This dimensional approach transforms the heat dissipation from a single-direction process to a multi-directional system, enabling effective heat removal while preserving the closed housing structure.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Stability of the object's composition

If heat is not dissipated from the emitting chamber, then the closed structure is maintained, but the lifetime of laser emitters deteriorates

Engineering Contradiction:

Improveclosed structureVSAvoidlaser emitter lifetime

Core Design Contradiction:

Stability of the object's compositionVSDuration of action of stationary object

Solution Approach 1:

Heat dissipation components serve as intermediary elements between the heat-generating printed circuit board and the chamber walls. These intermediaries conduct heat away from the laser emitters to the chamber walls, which then dissipate heat to the external environment, thereby protecting the laser emitters without compromising the closed structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

Heat is extracted from the emitting chamber through the heat dissipation components that are attached to the chamber walls. This extraction process removes the harmful thermal energy from the closed chamber while maintaining the structural integrity, thereby extending the lifetime of the laser emitters.

Inventive Principle:

Principle #2Taking out (Extraction)

3Temperature

If a traditional heat sink is used, then heat dissipation is improved, but localized overheating of the printed circuit board persists

Engineering Contradiction:

Improveoverall heat dissipationVSAvoidlocalized overheating

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

Instead of using a single traditional heat sink, the solution segments the heat dissipation function into multiple heat dissipation components distributed across different chamber walls. This segmentation ensures that heat is drawn from multiple locations on the printed circuit board simultaneously, preventing localized overheating while maintaining overall heat dissipation efficiency.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Each heat dissipation component is locally attached to specific areas of the printed circuit board and oriented toward different chamber walls. This local quality approach ensures that heat is dissipated from specific hot spots on the PCB, addressing localized overheating issues while maintaining effective overall heat removal.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces localized overheating, prolongs the lifetime of laser emitters, and improves the reliability of lidar devices by ensuring efficient heat dissipation.

Implementation Method 1

heat of the first printed circuit board is conducted to a chamber wall of the emitting chamber through the first heat dissipation component

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12591042B2Lidar

Publication Date: 2026.03.31 HESAI TECH CO LTD

AI summary

A lidar is provided. The lidar comprises an emitting chamber, where at least one first printed circuit board and a film-shaped first heat dissipation component corresponding to the first printed circuit board is disposed therein. A laser emitter is disposed on the first printed circuit board which is configured to drive the laser emitter to emit a laser pulse. The first heat dissipation component includes a thermally conductive assembly portion and a heat dissipation assembly portion that are not coplanar. The thermally conductive assembly portion is attached on a back face of the first printed circuit board corresponding to the thermally conductive assembly portion. A portion of the heat dissipation assembly portion is connected to a chamber wall forming the emitting chamber. Temperature of the first printed circuit board is controlled to solve lidar reliability problem caused by overheating of the first printed circuit board.