Integrated LIDAR Chip Packaging for Optical Routing and Heat Dissipation
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Solution Overview
Problem
There is a need for an efficient chip-scale package solution to configure and integrate photonic components in LIDAR sensor systems for autonomous vehicles, providing effective optical signal pathways and heat dissipation.
Innovation Solution
The integrated chip packaging includes a laser assembly, optical amplifier array chip, transceiver chip, cold plate, and heat transfer components to maintain component temperatures and facilitate optical and electrical connections, with heat transfer components utilizing thermal interface materials, thermoelectric coolers, or liquid cooling systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If photonic components are integrated in a chip-scale package, then device compactness and integration efficiency are improved, but heat dissipation becomes more challenging due to confined space
Solution Approach 1:
The chip package is segmented into distinct functional regions: an optical region for photonic component operation and a heat dissipation region with thermal management structures. This segmentation allows simultaneous optimization of optical performance and thermal management by spatially separating these competing requirements.
Solution Approach 2:
A thermal interface material or heat spreader is introduced as an intermediary between the heat-generating photonic components and the heat dissipation region. This intermediary efficiently transfers heat from the confined optical region to the thermal management structures, resolving the heat dissipation challenge in the compact chip-scale package.
2Productivity
If optical components are densely integrated, then optical signal pathway efficiency is improved, but temperature control becomes more difficult
Solution Approach 1:
Different regions of the chip package are assigned different thermal properties: the optical region is designed for optimal optical signal pathways with minimal thermal interference, while the heat dissipation region incorporates high thermal conductivity materials and structures. This local differentiation allows dense optical integration while maintaining temperature control through specialized thermal zones.
3Device complexity
If multiple photonic components are integrated on a single chip, then device complexity is reduced, but manufacturing precision requirements increase
Solution Approach 1:
Multiple photonic components are merged onto a single chip substrate, integrating laser sources, modulators, detectors, and waveguides into one unified device. This merging reduces overall system complexity and inter-component connections while necessitating precise manufacturing techniques to ensure proper alignment and functionality of the integrated components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures efficient heat dissipation and maintains optical component performance, enabling accurate range and velocity determination for autonomous vehicle operations.
Implementation Method 1
a first heat transfer component coupled to the first surface of the transceiver chip, the first heat transfer component configured to maintain a temperature of the transceiver chip at or below the reference temperature
Implementation Method 2
heat transfer components utilizing thermal interface materials, thermoelectric coolers, or liquid cooling systems
Data Source
AI summary
An integrated chip packaging for a LIDAR sensor mounted to a vehicle includes a laser assembly configured to output a beam, an optical amplifier array chip configured to amplify a beam, and a transceiver chip coupled to the laser assembly and the optical amplifier array chip. The transceiver chip may be configured to emit the beam with reference to a first surface of the transceiver chip through an optical window and receive a reflected beam from a target through the optical window. The integrated chip packaging for the LIDAR sensor defines the configuration of optical components for providing a path for the optical signal to travel in and out of the LIDAR sensor and dissipating the heat generated by the optical components for improved performance.